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Issue Date	Title	Author(s)
2017-06	Process enabling highly accurate die position for fan-out package applications	김영호
2017-11	Effect of Cu electroplating parameters on microvoid formation and high-speed shear strength in Sn-3.0Ag-0.5Cu/Cu joints	김영호
2017-11	Adhesion of NCF to oxidized Si wafers after oxygen plasma treatment	김영호
2017-11	Degradation of adhesion between Cu and epoxy-based dielectric during exposure to hot humid environments	김영호
2017-12	Enhanced Bonding by Applied Current in Cu-to-Cu Joints Fabricated Using 20 mu m Cu Microbumps	김영호
2019-06	Shear strength between Sn–3.0Ag–0.5Cu solders and Cu substrate after two solid-state aging processes for fan-out package process applications	김영호
2018-01	Effects of Solder Volume and Reflow Conditions on Self-Alignment Accuracy for Fan-Out Package Applications	김영호
2018-01	Effect of Ni-P Plating Temperature on Growth of Interfacial Intermetallic Compound in Electroless Nickel Immersion Gold/Sn-Ag-Cu Solder Joints	김영호
2019-03	Electromigration reliability of Sn–3.0Ag–0.5Cu/Cu–Zn solder joints	김영호
2012-04	Interface Analysis of Embedded Chip Resistor Device Package and Its Effect on Drop Shock Reliability	김영호

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