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COLLEGE OF ENGINEERING[S](공과대학)
MATERIALS SCIENCE AND ENGINEERING(신소재공학부)
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2019-06
Shear strength between Sn–3.0Ag–0.5Cu solders and Cu substrate after two solid-state aging processes for fan-out package process applications
김영호
2019-03
Electromigration reliability of Sn–3.0Ag–0.5Cu/Cu–Zn solder joints
김영호
2019-09
Void fraction of a Sn–Ag–Cu solder joint underneath a chip resistor and its effect on joint strength and thermomechanical reliability
김영호
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EUTECTIC SNPB SOLDER
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