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COLLEGE OF ENGINEERING[S](공과대학)
MATERIALS SCIENCE AND ENGINEERING(신소재공학부)
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2019-03
Electromigration reliability of Sn–3.0Ag–0.5Cu/Cu–Zn solder joints
김영호
2016-02
Effect of Zn concentration on the interfacial reactions between Sn–3.0Ag–0.5Cu solder and electroplated Cu–xZn wetting layers (x 5 0–43 wt%)
김영호
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