Browsing "MATERIALS SCIENCE AND ENGINEERING(신소재공학부)" byAuthor김영호

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Showing results 55 to 58 of 58

Issue DateTitleAuthor(s)
2019-09Void fraction of a Sn–Ag–Cu solder joint underneath a chip resistor and its effect on joint strength and thermomechanical reliability김영호
2013-03Wetting characteristics of Cu-xZn layers for Sn-3.0Ag-0.5Cu solders김영호
2011-11부품내장기술을 이용한 통신기기용 패키징 소형화 기술동향김영호
2012-09칩내장형 PCB 공정을 위한 칩 표면처리 공정에 관한 연구김영호

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