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Browsing "MATERIALS SCIENCE AND ENGINEERING(신소재공학부)" byAuthor김영호
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Showing results 43 to 58 of 58
Issue Date
Title
Author(s)
2016-10
A peel adhesion study of electroless Cu layers on polymer substrates
김영호
2017-06
Process enabling highly accurate die position for fan-out package applications
김영호
2014-02
Reliability of Cu to Cu joints fabricated using SnAg capping layer for 3D applications
김영호
2011-03
Resistance switching properties of In2O3 nanocrystals memory device with organic and inorganic hybrid structure
김영호
2012-10
Resistive switching effect for ZnO hybrid memory with metal-oxide nanocrystals
김영호
2012-07
Resistive-Switching Memory Effect of Hybrid Structures with Polyimide and SnO2 Nanocrystals
김영호
2013-11
The role of ZnO-coating-layer thickness on the recombination in CdS quantum-dot-sensitized solar cells
김영호
2019-06
Shear strength between Sn–3.0Ag–0.5Cu solders and Cu substrate after two solid-state aging processes for fan-out package process applications
김영호
2012-04
Sputtered Ni-Zn under bump metallurgy (UBM) for Sn-Ag-Cu solders
김영호
2014-08
Synthesis of Cu or Cu2O-polyimide nanocomposites using Cu powders and their optical properties
김영호
2014-11
Synthesis of Dual Nanoparticles Embedded in Polyimide and Their Optical Properties
김영호
2012-05
Ultra-fine pitch chip-on-glass (COG) bonding with metal bumps having insulating layer in the side walls using anisotropic conductive film (ACF)
김영호
2019-09
Void fraction of a Sn–Ag–Cu solder joint underneath a chip resistor and its effect on joint strength and thermomechanical reliability
김영호
2013-03
Wetting characteristics of Cu-xZn layers for Sn-3.0Ag-0.5Cu solders
김영호
2011-11
부품내장기술을 이용한 통신기기용 패키징 소형화 기술동향
김영호
2012-09
칩내장형 PCB 공정을 위한 칩 표면처리 공정에 관한 연구
김영호
1
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