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Showing results 43 to 58 of 58

Issue DateTitleAuthor(s)
2016-10A peel adhesion study of electroless Cu layers on polymer substrates김영호
2017-06Process enabling highly accurate die position for fan-out package applications김영호
2014-02Reliability of Cu to Cu joints fabricated using SnAg capping layer for 3D applications김영호
2011-03Resistance switching properties of In2O3 nanocrystals memory device with organic and inorganic hybrid structure김영호
2012-10Resistive switching effect for ZnO hybrid memory with metal-oxide nanocrystals김영호
2012-07Resistive-Switching Memory Effect of Hybrid Structures with Polyimide and SnO2 Nanocrystals김영호
2013-11The role of ZnO-coating-layer thickness on the recombination in CdS quantum-dot-sensitized solar cells김영호
2019-06Shear strength between Sn–3.0Ag–0.5Cu solders and Cu substrate after two solid-state aging processes for fan-out package process applications김영호
2012-04Sputtered Ni-Zn under bump metallurgy (UBM) for Sn-Ag-Cu solders김영호
2014-08Synthesis of Cu or Cu2O-polyimide nanocomposites using Cu powders and their optical properties김영호
2014-11Synthesis of Dual Nanoparticles Embedded in Polyimide and Their Optical Properties김영호
2012-05Ultra-fine pitch chip-on-glass (COG) bonding with metal bumps having insulating layer in the side walls using anisotropic conductive film (ACF)김영호
2019-09Void fraction of a Sn–Ag–Cu solder joint underneath a chip resistor and its effect on joint strength and thermomechanical reliability김영호
2013-03Wetting characteristics of Cu-xZn layers for Sn-3.0Ag-0.5Cu solders김영호
2011-11부품내장기술을 이용한 통신기기용 패키징 소형화 기술동향김영호
2012-09칩내장형 PCB 공정을 위한 칩 표면처리 공정에 관한 연구김영호
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