2015-12 | Low temperature chip on film bonding technology for 20 mu m pitch applications | 김영호 |
2015-07 | Mechanical and electrical stability of PEDOT: PTS and Au source/drain electrodes for bottom contact OTFTs on plastic films under bending conditions | 김영호 |
2016-10 | A peel adhesion study of electroless Cu layers on polymer substrates | 김영호 |
2017-06 | Process enabling highly accurate die position for fan-out package applications | 김영호 |
2014-02 | Reliability of Cu to Cu joints fabricated using SnAg capping layer for 3D applications | 김영호 |
2011-03 | Resistance switching properties of In2O3 nanocrystals memory device with organic and inorganic hybrid structure | 김영호 |
2012-10 | Resistive switching effect for ZnO hybrid memory with metal-oxide nanocrystals | 김영호 |
2012-07 | Resistive-Switching Memory Effect of Hybrid Structures with Polyimide and SnO2 Nanocrystals | 김영호 |
2013-11 | The role of ZnO-coating-layer thickness on the recombination in CdS quantum-dot-sensitized solar cells | 김영호 |
2019-06 | Shear strength between Sn–3.0Ag–0.5Cu solders and Cu substrate after two solid-state aging processes for fan-out package process applications | 김영호 |
2012-04 | Sputtered Ni-Zn under bump metallurgy (UBM) for Sn-Ag-Cu solders | 김영호 |
2014-08 | Synthesis of Cu or Cu2O-polyimide nanocomposites using Cu powders and their optical properties | 김영호 |
2014-11 | Synthesis of Dual Nanoparticles Embedded in Polyimide and Their Optical Properties | 김영호 |
2012-05 | Ultra-fine pitch chip-on-glass (COG) bonding with metal bumps having insulating layer in the side walls using anisotropic conductive film (ACF) | 김영호 |
2019-09 | Void fraction of a Sn–Ag–Cu solder joint underneath a chip resistor and its effect on joint strength and thermomechanical reliability | 김영호 |
2013-03 | Wetting characteristics of Cu-xZn layers for Sn-3.0Ag-0.5Cu solders | 김영호 |
2011-11 | 부품내장기술을 이용한 통신기기용 패키징 소형화 기술동향 | 김영호 |
2012-09 | 칩내장형 PCB 공정을 위한 칩 표면처리 공정에 관한 연구 | 김영호 |