| 2012-03 | 150oC 이하 저온에서의 미세 접합 기술 | 김영호 |
| 2017-11 | Adhesion of NCF to oxidized Si wafers after oxygen plasma treatment | 김영호 |
| 2013-01 | Adhesion Study between Electroless Seed Layers and Build-up Dielectric Film Substrates | 김영호 |
| 2014-05 | Chip to Chip Bonding Using Cu Bumps Capped with Thin Sn Layers and the Effect of Microstructure on the Shear Strength of Joints | 김영호 |
| 2015-04 | Current-assisted direct Cu/Cu joining | 김영호 |
| 2017-11 | Degradation of adhesion between Cu and epoxy-based dielectric during exposure to hot humid environments | 김영호 |
| 2015-05 | Development of chip-on-flex bonding using Sn-based bumps and non-conductive adhesive | 김영호 |
| 2013-05 | Development of Highly Reliable Flip-chip Bonding Technology using Non-conductive Adhesives (NCAs) for 20 um Pitch Application | 김영호 |
| 2012-12 | Development of low temperature CHip-on-Flex (COF) bonding process of 100℃ | 김영호 |
| 2016-08 | Drop-shock reliability improvement of embedded chip resistor packages through via structure modification | 김영호 |
| 2013-05 | An Eco-friendly Cu-Zn Wetting Layer for Highly Reliable Solder Joints | 김영호 |
| 2020-05 | Effect of (Ni, Au)(3)Sn-4 growth on the thermal resistance of Au-20 wt% Sn solder/ENIG joint in flip-chip LED packages | 김영호 |
| 2017-11 | Effect of Cu electroplating parameters on microvoid formation and high-speed shear strength in Sn-3.0Ag-0.5Cu/Cu joints | 김영호 |
| 2011-11 | The Effect of Fillers in Nonconductive Adhesive on the Reliability of Chip-on-Glass Bonding with Sn/Cu Bumps | 김영호 |
| 2018-01 | Effect of Ni-P Plating Temperature on Growth of Interfacial Intermetallic Compound in Electroless Nickel Immersion Gold/Sn-Ag-Cu Solder Joints | 김영호 |
| 2012-02 | Effect of Pd Thickness on the Interfacial Reaction and Shear Strength in Solder Joints Between Sn-3.0Ag-0.5Cu Solder and Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Surface Finish | 김영호 |
| 2013-07 | Effect of permanganate treatment on through mold vias for an embedded wafer level package | 김영호 |
| 2016-03 | The effect of solder wetting on nonconductive adhesive (NCA) trapping in NCA applied flip-chip bonding | 김영호 |
| 2016-02 | Effect of Zn concentration on the interfacial reactions between Sn–3.0Ag–0.5Cu solder and electroplated Cu–xZn wetting layers (x 5 0–43 wt%) | 김영호 |
| 2016-03 | Effects of Bath Composition on the Adhesion Characteristics of Electroless Cu Layers on Epoxy-Based Polymer Substrates | 김영호 |
| 2013-05 | The effects of solder deformation on the wetting characteristics and interfacial reaction of Sn-3.5Ag solders on Cu substrates in fluxless soldering | 김영호 |
| 2018-01 | Effects of Solder Volume and Reflow Conditions on Self-Alignment Accuracy for Fan-Out Package Applications | 김영호 |
| 2013-03 | Electrical characteristics of resistive switching memory with metal oxide nanoparticles on a graphene layer | 김영호 |
| 2011-03 | Electrochemical albumin sensing based on silicon nanowires modified by gold nanoparticles | 김영호 |
| 2019-03 | Electromigration reliability of Sn–3.0Ag–0.5Cu/Cu–Zn solder joints | 김영호 |
| 2017-12 | Enhanced Bonding by Applied Current in Cu-to-Cu Joints Fabricated Using 20 mu m Cu Microbumps | 김영호 |
| 2020-01 | Epoxy/silane pre-synthesis improving thermal properties and adhesion strength of silica-filled non-conductive adhesive for fine-pitch thermocompression bonding | 김영호 |
| 2012-04 | Fabrication of Copper Nanoparticles in a Thick Polyimide Film Cured by Rapid Thermal Annealing | 김영호 |
| 2012-11 | Facile synthesis of porous-carbon/LiFePO4 nanocomposites | 김영호 |
| 2013-05 | Flip chip bonding with anisotropic conductive film (ACF) and nonconductive adhesive (NCA) | 김영호 |
