Browsing "MATERIALS SCIENCE AND ENGINEERING(신소재공학부)" byAuthor김영호

Jump to:
All A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
  • Sort by:
  • In order:
  • Results/Page
  • Authors/Record:

Showing results 1 to 30 of 58

Issue DateTitleAuthor(s)
2012-03150oC 이하 저온에서의 미세 접합 기술김영호
2017-11Adhesion of NCF to oxidized Si wafers after oxygen plasma treatment김영호
2013-01Adhesion Study between Electroless Seed Layers and Build-up Dielectric Film Substrates김영호
2014-05Chip to Chip Bonding Using Cu Bumps Capped with Thin Sn Layers and the Effect of Microstructure on the Shear Strength of Joints김영호
2015-04Current-assisted direct Cu/Cu joining김영호
2017-11Degradation of adhesion between Cu and epoxy-based dielectric during exposure to hot humid environments김영호
2015-05Development of chip-on-flex bonding using Sn-based bumps and non-conductive adhesive김영호
2013-05Development of Highly Reliable Flip-chip Bonding Technology using Non-conductive Adhesives (NCAs) for 20 um Pitch Application김영호
2012-12Development of low temperature CHip-on-Flex (COF) bonding process of 100℃김영호
2016-08Drop-shock reliability improvement of embedded chip resistor packages through via structure modification김영호
2013-05An Eco-friendly Cu-Zn Wetting Layer for Highly Reliable Solder Joints김영호
2020-05Effect of (Ni, Au)(3)Sn-4 growth on the thermal resistance of Au-20 wt% Sn solder/ENIG joint in flip-chip LED packages김영호
2017-11Effect of Cu electroplating parameters on microvoid formation and high-speed shear strength in Sn-3.0Ag-0.5Cu/Cu joints김영호
2011-11The Effect of Fillers in Nonconductive Adhesive on the Reliability of Chip-on-Glass Bonding with Sn/Cu Bumps김영호
2018-01Effect of Ni-P Plating Temperature on Growth of Interfacial Intermetallic Compound in Electroless Nickel Immersion Gold/Sn-Ag-Cu Solder Joints김영호
2012-02Effect of Pd Thickness on the Interfacial Reaction and Shear Strength in Solder Joints Between Sn-3.0Ag-0.5Cu Solder and Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Surface Finish김영호
2013-07Effect of permanganate treatment on through mold vias for an embedded wafer level package김영호
2016-03The effect of solder wetting on nonconductive adhesive (NCA) trapping in NCA applied flip-chip bonding김영호
2016-02Effect of Zn concentration on the interfacial reactions between Sn–3.0Ag–0.5Cu solder and electroplated Cu–xZn wetting layers (x 5 0–43 wt%)김영호
2016-03Effects of Bath Composition on the Adhesion Characteristics of Electroless Cu Layers on Epoxy-Based Polymer Substrates김영호
2013-05The effects of solder deformation on the wetting characteristics and interfacial reaction of Sn-3.5Ag solders on Cu substrates in fluxless soldering김영호
2018-01Effects of Solder Volume and Reflow Conditions on Self-Alignment Accuracy for Fan-Out Package Applications김영호
2013-03Electrical characteristics of resistive switching memory with metal oxide nanoparticles on a graphene layer김영호
2011-03Electrochemical albumin sensing based on silicon nanowires modified by gold nanoparticles김영호
2019-03Electromigration reliability of Sn–3.0Ag–0.5Cu/Cu–Zn solder joints김영호
2017-12Enhanced Bonding by Applied Current in Cu-to-Cu Joints Fabricated Using 20 mu m Cu Microbumps김영호
2020-01Epoxy/silane pre-synthesis improving thermal properties and adhesion strength of silica-filled non-conductive adhesive for fine-pitch thermocompression bonding김영호
2012-04Fabrication of Copper Nanoparticles in a Thick Polyimide Film Cured by Rapid Thermal Annealing김영호
2012-11Facile synthesis of porous-carbon/LiFePO4 nanocomposites김영호
2013-05Flip chip bonding with anisotropic conductive film (ACF) and nonconductive adhesive (NCA)김영호