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Abrasive and additive interactions in high selectivity STI CMP slurries

Title
Abrasive and additive interactions in high selectivity STI CMP slurries
Author
박진구
Keywords
Shallow trench isolation; CMP; High selectivity; Ceria; Amino acids
Issue Date
2014-01
Publisher
Elsevier B.V
Citation
Microelectronic Engineering February 2014, 114, 98-104
Abstract
Ceria based slurries with additives are widely used in shallow trench isolation (STI) chemical mechanical planarization (CMP) process to obtain high selective removal of silicon dioxide over silicon nitride. In this study ceria from different sources were used as abrasives and l-proline and l-glutamic acid were used as additives, with a focus on identifying the interactions between abrasives and additives and their effect of selectivity. Ceria particles were characterized using X-ray diffraction (XRD), energy dispersive X-ray (EDX) spectroscopy, transmission electron microscopy (TEM) and X-ray photoelectron spectroscopy (XPS) while the additive abrasive interactions were evaluated by UV?Visible spectroscopy and inductively coupled plasma optical emission spectroscopy (ICP-OES) analysis. While slurries with l-proline yielded high selectivity only with certain type of ceria, slurries with l-glutamic acid were found to be less sensitive to the ceria source than those with l-proline, and yielded high selectivity regardless of the source of ceria used. The purity of the abrasive and its crystal structure appear to play a significant role in determining the selectivity.
URI
http://www.sciencedirect.com/science/article/pii/S0167931713006266?via%3Dihubhttp://hdl.handle.net/20.500.11754/47222
ISSN
0167-9317
DOI
10.1016/j.mee.2013.10.004
Appears in Collections:
GRADUATE SCHOOL[S](대학원) > BIONANOTECHNOLOGY(바이오나노학과) > Articles
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