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dc.contributor.author소홍윤-
dc.date.accessioned2018-03-11T02:12:43Z-
dc.date.available2018-03-11T02:12:43Z-
dc.date.issued2013-10-
dc.identifier.citationAPPLIED PHYSICS LETTERS, 2013, 103(16), P.163102- (5pages)en_US
dc.identifier.issn0003-6951-
dc.identifier.issn1077-3118-
dc.identifier.urihttp://aip.scitation.org/doi/abs/10.1063/1.4825169-
dc.identifier.urihttp://hdl.handle.net/20.500.11754/44864-
dc.description.abstractWe report an efficient passive micro pump system combining the physical properties of nanowires and micropores. This nanowire-integrated microporous silicon membrane was created to feed coolant continuously onto the surface of the wick in a micro cooling device to ensure it remains hydrated and in case of dryout, allow for regeneration of the system. The membrane was fabricated by photoelectrochemical etching to form micropores followed by hydrothermal growth of nanowires. This study shows a promising approach to address thermal management challenges for next generation electronic devices with absence of external power. (C) 2013 AIP Publishing LLC.en_US
dc.description.sponsorshipThis work was supported by the DARPA Thermal Ground Plane (TGP) award (Grant No. HR0011-10-C-0100) under the DARPA MTO. We also thank the UC Berkeley Marvell Nanolab where all devices were fabricated.en_US
dc.language.isoenen_US
dc.publisherAMER INST PHYSICS, CIRCULATION & FULFILLMENT DIV, 2 HUNTINGTON QUADRANGLE, STE 1 N O 1, MELVILLE, NY 11747-4501 USAen_US
dc.subjectMaterialsen_US
dc.subjectElectrochemistryen_US
dc.subjectMetalsen_US
dc.subjectCondensed matter propertiesen_US
dc.subjectSiliconen_US
dc.subjectElectronic transporten_US
dc.subjectLiquid surfacesen_US
dc.subjectNanowiresen_US
dc.subjectMetalloidsen_US
dc.subjectMetallurgyen_US
dc.subjectLOOP HEAT-PIPEen_US
dc.subjectN-TYPE SILICONen_US
dc.subjectTHERMAL MANAGEMENTen_US
dc.subjectPOROUS SILICONen_US
dc.subjectELECTRONICSen_US
dc.subjectZNOen_US
dc.subjectPERFORMANCEen_US
dc.subjectCONVECTIONen_US
dc.subjectSYSTEMSen_US
dc.subjectFILMSen_US
dc.titleNanowire-integrated microporous silicon membrane for continuous fluid transport in micro cooling deviceen_US
dc.typeArticleen_US
dc.identifier.doi10.1063/1.4825169-
dc.relation.journalAPPLIED PHYSICS LETTERS-
dc.contributor.googleauthorSo, Hongyun-
dc.contributor.googleauthorCheng, Jim C.-
dc.contributor.googleauthorPisano, Albert P.-
dc.relation.code2013008977-
dc.sector.campusS-
dc.sector.daehakCOLLEGE OF ENGINEERING[S]-
dc.sector.departmentDIVISION OF MECHANICAL ENGINEERING-
dc.identifier.pidhyso-
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COLLEGE OF ENGINEERING[S](공과대학) > MECHANICAL ENGINEERING(기계공학부) > Articles
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