Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 소홍윤 | - |
dc.date.accessioned | 2018-03-11T02:12:43Z | - |
dc.date.available | 2018-03-11T02:12:43Z | - |
dc.date.issued | 2013-10 | - |
dc.identifier.citation | APPLIED PHYSICS LETTERS, 2013, 103(16), P.163102- (5pages) | en_US |
dc.identifier.issn | 0003-6951 | - |
dc.identifier.issn | 1077-3118 | - |
dc.identifier.uri | http://aip.scitation.org/doi/abs/10.1063/1.4825169 | - |
dc.identifier.uri | http://hdl.handle.net/20.500.11754/44864 | - |
dc.description.abstract | We report an efficient passive micro pump system combining the physical properties of nanowires and micropores. This nanowire-integrated microporous silicon membrane was created to feed coolant continuously onto the surface of the wick in a micro cooling device to ensure it remains hydrated and in case of dryout, allow for regeneration of the system. The membrane was fabricated by photoelectrochemical etching to form micropores followed by hydrothermal growth of nanowires. This study shows a promising approach to address thermal management challenges for next generation electronic devices with absence of external power. (C) 2013 AIP Publishing LLC. | en_US |
dc.description.sponsorship | This work was supported by the DARPA Thermal Ground Plane (TGP) award (Grant No. HR0011-10-C-0100) under the DARPA MTO. We also thank the UC Berkeley Marvell Nanolab where all devices were fabricated. | en_US |
dc.language.iso | en | en_US |
dc.publisher | AMER INST PHYSICS, CIRCULATION & FULFILLMENT DIV, 2 HUNTINGTON QUADRANGLE, STE 1 N O 1, MELVILLE, NY 11747-4501 USA | en_US |
dc.subject | Materials | en_US |
dc.subject | Electrochemistry | en_US |
dc.subject | Metals | en_US |
dc.subject | Condensed matter properties | en_US |
dc.subject | Silicon | en_US |
dc.subject | Electronic transport | en_US |
dc.subject | Liquid surfaces | en_US |
dc.subject | Nanowires | en_US |
dc.subject | Metalloids | en_US |
dc.subject | Metallurgy | en_US |
dc.subject | LOOP HEAT-PIPE | en_US |
dc.subject | N-TYPE SILICON | en_US |
dc.subject | THERMAL MANAGEMENT | en_US |
dc.subject | POROUS SILICON | en_US |
dc.subject | ELECTRONICS | en_US |
dc.subject | ZNO | en_US |
dc.subject | PERFORMANCE | en_US |
dc.subject | CONVECTION | en_US |
dc.subject | SYSTEMS | en_US |
dc.subject | FILMS | en_US |
dc.title | Nanowire-integrated microporous silicon membrane for continuous fluid transport in micro cooling device | en_US |
dc.type | Article | en_US |
dc.identifier.doi | 10.1063/1.4825169 | - |
dc.relation.journal | APPLIED PHYSICS LETTERS | - |
dc.contributor.googleauthor | So, Hongyun | - |
dc.contributor.googleauthor | Cheng, Jim C. | - |
dc.contributor.googleauthor | Pisano, Albert P. | - |
dc.relation.code | 2013008977 | - |
dc.sector.campus | S | - |
dc.sector.daehak | COLLEGE OF ENGINEERING[S] | - |
dc.sector.department | DIVISION OF MECHANICAL ENGINEERING | - |
dc.identifier.pid | hyso | - |
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