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dc.contributor.author김정현-
dc.date.accessioned2018-02-05T07:47:43Z-
dc.date.available2018-02-05T07:47:43Z-
dc.date.issued2015-01-
dc.identifier.citationIEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v. 25, No. 1, Page. 49-51en_US
dc.identifier.issn1531-1309-
dc.identifier.issn1558-1764-
dc.identifier.urihttp://ieeexplore.ieee.org/abstract/document/6954521/-
dc.identifier.urihttp://hdl.handle.net/20.500.11754/35435-
dc.description.abstract"Fully-integrated multi-mode multi-band (MMMB) reconfigurable power amplifier (PA) is implemented using single PA-cores for high-and low-frequency bands, respectively. This PA has five output paths and covers quad-band Gaussian Minimum Shift Keying/Enhanced Data Rates for Global Evolution and penta-band Universal Mobile Telecommunications System/Long Term Evolution mode operation with band combination in a small form-factor. To optimize the PA, the proposed structure reconfigures the PA-core cells as well as the interstage/output matching network. When compared with the single-mode single-band dedicated PAs, the fabricated PA showed comparable RF performance for all modes and bands, except for PAE degradations of 3.1% and 1.9% for high-and low-band, respectively, thus validating the usefulness of the proposed structure for MMMB PA applications."en_US
dc.description.sponsorshipThis work was supported by the Basic Science Research Prop-am through the National Research Foundation of Korea (NRF) funded by the Ministry of Education (2013R1A1A2013345).en_US
dc.language.isoen_USen_US
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCen_US
dc.subjectMulti-banden_US
dc.subjectmulti-modeen_US
dc.subjectpenta-band UMTS/LTEen_US
dc.subjectquad-band GMSK/EDGEen_US
dc.subjectreconfigurable power amplifier (PA)en_US
dc.subjectsingle PA-coreen_US
dc.titleA Multi-Mode Multi-Band Reconfigurable Power Amplifier for 2G/3G/4G Handset Applicationsen_US
dc.typeArticleen_US
dc.relation.no1-
dc.relation.volume25-
dc.identifier.doi10.1109/LMWC.2014.2367164-
dc.relation.page49-51-
dc.relation.journalIEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS-
dc.contributor.googleauthorKang, SY-
dc.contributor.googleauthorKim, UH-
dc.contributor.googleauthorKim, JH-
dc.relation.code2015001405-
dc.sector.campusE-
dc.sector.daehakCOLLEGE OF ENGINEERING SCIENCES[E]-
dc.sector.departmentDIVISION OF ELECTRICAL ENGINEERING-
dc.identifier.pidjunhkim-
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COLLEGE OF ENGINEERING SCIENCES[E](공학대학) > ELECTRICAL ENGINEERING(전자공학부) > Articles
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