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High Performance Metal Oxide Field-Effect Transistors with a Reverse Offset Printed Cu Source/Drain Electrode

Title
High Performance Metal Oxide Field-Effect Transistors with a Reverse Offset Printed Cu Source/Drain Electrode
Author
정재경
Keywords
printing process; copper film; reverse offset; field-effect transistor; zinc tin oxide
Issue Date
2016-01
Publisher
AMER CHEMICAL SOC
Citation
ACS APPLIED MATERIALS & INTERFACES, v. 8, NO 2, Page. 1156-1163
Abstract
Nonvacuum and photolithography-free copper (Cu) films were prepared by reverse offset printing. The mechanical, morphological, structural, and chemical properties of the Cu films annealed at different temperatures were examined in detail. The Ostwald ripening-induced coalescence and grain growth in the printing Cu films were enhanced with increasing annealing temperature in N2 ambient up to 400 degrees C. Simultaneously, unwanted chemical impurities such as oxygen, hydrogen, and carbon in the Cu films decreased as the annealing temperature increased. The high electrical conductivity (similar to 6.2 mu O.cm) of the printing Cu films annealed at 400 degrees C is attributed to the enlargement of the grain size and reduction of the incorporation of impurities. A printing Cu film was adopted as a source/drain (S/D) electrode in solution processable zinc tin oxide (ZTO) field-effect transistors (FETs), where the ZTO film was prepared by simple spin-coating. The ZTO FETs fabricated at a contact annealing temperature of 250 degrees C exhibited a promising field-effect mobility of 2.6 cm(2)/(V s), a threshold voltage of 7.0 V, and an ION/OFF modulation ratio of 2 x 10(5).
URI
http://pubs.acs.org/doi/10.1021/acsami.5b08969http://hdl.handle.net/20.500.11754/30467
ISSN
1944-8244
DOI
10.1021/acsami.5b08969
Appears in Collections:
COLLEGE OF ENGINEERING[S](공과대학) > ELECTRONIC ENGINEERING(융합전자공학부) > Articles
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