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Highly Thermal Conductive Alimina Plate/Epoxy Composite for Electronic Packaging

Title
Highly Thermal Conductive Alimina Plate/Epoxy Composite for Electronic Packaging
Author
심광보
Keywords
Alumina-epoxy composite; Ordering; Thermal property
Issue Date
2015-12
Publisher
한국전기전자재료학회
Citation
Transactions on Electrical and Electronic Materials, Vol. 16, No. 6, Page. 351-354
Abstract
In this study, alumina plates 9~25 μm in size were used as thermal fillers, and epoxy resin was used as a polymer matrix. Oriented alumina plate/epoxy composites were prepared using a rolling method. The effect of ordering alumina plates increased with alumina plate size. The thermal conductivity and flexural strength of the composites were investigated. The horizontal thermal conductivity of the oriented composite was significantly higher than the vertical thermal conductivity. The horizontal thermal conductivity of the 75 wt% alumina content was 8.78 W/mk, although the vertical thermal conductivity was 1.04 W/mk. Ordering of the alumina plate using a rolling method significantly improved the thermal conductivity in the horizontal direction. The flexural strengths of the ordered alumina/epoxy composites prepared at different curing temperatures were measured.
URI
http://koreascience.or.kr/article/ArticleFullRecord.jsp?cn=E1TEAO_2015_v16n6_351http://hdl.handle.net/20.500.11754/29391
ISSN
1229-7607; 2092-7592
DOI
10.4313/TEEM.2015.16.6.351
Appears in Collections:
COLLEGE OF ENGINEERING[S](공과대학) > MATERIALS SCIENCE AND ENGINEERING(신소재공학부) > Articles
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