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Mode Matching Analysis of Via-Plate Capacitance in Multilayer Structures With Finite Plate Thickness

Title
Mode Matching Analysis of Via-Plate Capacitance in Multilayer Structures With Finite Plate Thickness
Author
정경영
Keywords
Hankel transform; mode matching method; multilayer structures; via-plate capacitance
Issue Date
2015-10
Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Citation
IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v. 57, NO 5, Page. 1188-1196
Abstract
In this paper, an analytical method for evaluation of via-plate capacitance including finite plate thickness in multilayer structures is proposed. An electrostatic boundary-value problem associated with a via in parallel plates is solved based on the Hankel transform and mode matching method, and thereby a fast-converging series-form expression for the via-plate capacitance is derived. The effect of finite plate thickness is taken into account by adopting the mode matching method instead of imposing an artificial perfect magnetic conductor boundary as in the previous works. We perform some computations to show the behaviors of the capacitance in terms of the via geometry, and they are validated through comparison with a static/quasi-static simulation, full-wave electromagnetic simulation, and the previous analytical solutions of via capacitance.
URI
http://ieeexplore.ieee.org/document/7140765/http://hdl.handle.net/20.500.11754/28385
ISSN
0018-9375; 1558-187X
DOI
10.1109/TEMC.2015.2440299
Appears in Collections:
COLLEGE OF ENGINEERING[S](공과대학) > ELECTRONIC ENGINEERING(융합전자공학부) > Articles
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