Repository at Hanyang UniversityCOLLEGE OF ENGINEERING[S](공과대학)MECHANICAL ENGINEERING(기계공학부)Articles
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 이관수 | - |
| dc.date.accessioned | 2017-08-04T05:25:59Z | - |
| dc.date.available | 2017-08-04T05:25:59Z | - |
| dc.date.issued | 2015-10 | - |
| dc.identifier.citation | INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, v. 89, Page. 1290-1296 | en_US |
| dc.identifier.issn | 0017-9310 | - |
| dc.identifier.issn | 1879-2189 | - |
| dc.identifier.uri | http://www.sciencedirect.com/science/article/pii/S0017931015006493?via%3Dihub | - |
| dc.identifier.uri | http://hdl.handle.net/20.500.11754/28300 | - |
| dc.description.abstract | In this study, the thermal performance of the printed circuit board (PCB) as a heat sink for the light-emitting diode (LED) bulb is analyzed. Cooling air is drawn through the bottom inlet of a case and exchanges heat from a vertically aligned PCB acting as a heat sink fin. The air then exits through a top outlet. Cooling performance is improved by arranging parallel PCBs to form a channel. Heat transfer is optimized by balancing cooling airflow rates on external and internal PCB surfaces, thereby reducing thermal resistance by 30% compared to previous designs. Cooling performance according to installation angle is investigated. The orientation effect on this channel design is determined to be 10% less than that of the reference design. Finally, the effect of PCB channel cooling performance on the LED bulb's life span is analyzed and shown to be 40% longer than that of the existing geometry. (C) 2015 Elsevier Ltd. All rights reserved. | en_US |
| dc.description.sponsorship | This work was supported by technology upgrade R&D program through the Commercialization Promotion Agency for R&D Outcomes (COMPA) funded by the Ministry of Science, ICT and Future Planning (MSIP) (No. 2013A000021). Additionally, the authors gratefully acknowledge the support provided by the Mechanical Engieering and Technical Research Institute of Hanyang University. | en_US |
| dc.language.iso | en | en_US |
| dc.publisher | PERGAMON-ELSEVIER SCIENCE LTD | en_US |
| dc.subject | LED bulb | en_US |
| dc.subject | Light-emitting diode (LED) lighting cooling | en_US |
| dc.subject | Printed circuit board (PCB) heat sink | en_US |
| dc.subject | Natural convection | en_US |
| dc.title | Thermal performance of a PCB channel heat sink for LED light bulbs | en_US |
| dc.type | Article | en_US |
| dc.relation.volume | 89 | - |
| dc.identifier.doi | 10.1016/j.ijheatmasstransfer.2015.06.027 | - |
| dc.relation.page | 1290-1296 | - |
| dc.relation.journal | INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER | - |
| dc.contributor.googleauthor | Jang, Daeseok | - |
| dc.contributor.googleauthor | Park, Seung-Jae | - |
| dc.contributor.googleauthor | Lee, Kwan-Soo | - |
| dc.relation.code | 2015000685 | - |
| dc.sector.campus | S | - |
| dc.sector.daehak | COLLEGE OF ENGINEERING[S] | - |
| dc.sector.department | DIVISION OF MECHANICAL ENGINEERING | - |
| dc.identifier.pid | ksleehy | - |
| dc.identifier.researcherID | C-5584-2015 | - |
| dc.identifier.orcid | http://orcid.org/0000-0003-0463-8514 | - |
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