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Thermal performance of a PCB channel heat sink for LED light bulbs

Title
Thermal performance of a PCB channel heat sink for LED light bulbs
Author
이관수
Keywords
LED bulb; Light-emitting diode (LED) lighting cooling; Printed circuit board (PCB) heat sink; Natural convection
Issue Date
2015-10
Publisher
PERGAMON-ELSEVIER SCIENCE LTD
Citation
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, v. 89, Page. 1290-1296
Abstract
In this study, the thermal performance of the printed circuit board (PCB) as a heat sink for the light-emitting diode (LED) bulb is analyzed. Cooling air is drawn through the bottom inlet of a case and exchanges heat from a vertically aligned PCB acting as a heat sink fin. The air then exits through a top outlet. Cooling performance is improved by arranging parallel PCBs to form a channel. Heat transfer is optimized by balancing cooling airflow rates on external and internal PCB surfaces, thereby reducing thermal resistance by 30% compared to previous designs. Cooling performance according to installation angle is investigated. The orientation effect on this channel design is determined to be 10% less than that of the reference design. Finally, the effect of PCB channel cooling performance on the LED bulb's life span is analyzed and shown to be 40% longer than that of the existing geometry. (C) 2015 Elsevier Ltd. All rights reserved.
URI
http://www.sciencedirect.com/science/article/pii/S0017931015006493?via%3Dihubhttp://hdl.handle.net/20.500.11754/28300
ISSN
0017-9310; 1879-2189
DOI
10.1016/j.ijheatmasstransfer.2015.06.027
Appears in Collections:
COLLEGE OF ENGINEERING[S](공과대학) > MECHANICAL ENGINEERING(기계공학부) > Articles
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