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dc.contributor.author서민석-
dc.date.accessioned2017-06-13T07:45:22Z-
dc.date.available2017-06-13T07:45:22Z-
dc.date.issued2015-09-
dc.identifier.citation반도체디스플레이기술학회지, v. 14, NO 3, Page. 13-22en_US
dc.identifier.issn1738-2270-
dc.identifier.urihttp://ocean.kisti.re.kr/IS_mvpopo213L.do?ResultTotalCNT=13&pageNo=1&pageSize=10&method=view&acnCn1=&poid=tkcs&kojic=BDCHBX&sVnc=v14n3&id=1&setId=&iTableId=&iDocId=&sFree=&pQuery=%28kojic%3ABDCHBX%29+AND+%28voliss_ctrl_no%3Av14n3%29-
dc.identifier.urihttp://hdl.handle.net/20.500.11754/27770-
dc.description.abstractLED (Light Emitting Diode) lighting is gaining more and more market penetration as one of the global warming countermeasures. LED is the next generation of fusion source composed of epi/chip/packaging of semiconductor process technology and optical/information/communication technology. LED has been applied to the existing industry areas, for example, automobiles, TVs, smartphones, laptops, refrigerators and street lamps. Therefore, LED makers have been striving to achieve the leading position in the global competition through development of core source technologies even before the promotion and adoption of LED technology as the next generation growth engine with eco-friendly characteristics. However, there has been a point of view on the cost compared to conventional lighting as a large obstacle to market penetration of LED. Therefore, companies are developing a Chip-Scale Packaging (CSP) LED technology to improve performance and reduce manufacturing costs. In this study, we perform patent analysis associated with Flip-Chip CSP LED and flow chart for promising technology forecasting. Based on our analysis, we select key patents and key patent players to derive the business strategy for the business success of Flip-Chip CSP PKG LED products.en_US
dc.language.isoko_KRen_US
dc.publisher한국반도체디스플레이기술학회en_US
dc.subjectLEDen_US
dc.subjectFlip-Chipen_US
dc.subjectCSP (Chip-Scale Packaging)en_US
dc.subjectPatent Analysisen_US
dc.subjectPromising Technologyen_US
dc.titleIP-R&D를 통한 자동차분야 LED 사업전략에 관한 연구: Flip-Chip을 채용한 CSP(Chip-Scale Packaging) 기술을 중심으로en_US
dc.title.alternativeA Study on Automotive LED Business Strategy Based on IP-R&D : Focused on Flip-Chip CSP (Chip-Scale Packaging)en_US
dc.typeArticleen_US
dc.relation.no3-
dc.relation.volume14-
dc.relation.page13-22-
dc.relation.journal반도체디스플레이기술학회지-
dc.contributor.googleauthor류창한-
dc.contributor.googleauthor최용규-
dc.contributor.googleauthor서민석-
dc.contributor.googleauthorRyu, Chang Han-
dc.contributor.googleauthorChoi, Yong Kyu-
dc.contributor.googleauthorSuh, Min Suk-
dc.relation.code2015040848-
dc.sector.campusS-
dc.sector.daehakGRADUATE SCHOOL OF TECHNOLOGY & INNOVATION MANAGEMENT[S]-
dc.sector.departmentDEPARTMENT OF TECHNOLOGY MANAGEMENT-
dc.identifier.pidmssuh-


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