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dc.contributor.author박진구-
dc.date.accessioned2017-06-08T07:43:53Z-
dc.date.available2017-06-08T07:43:53Z-
dc.date.issued2015-09-
dc.identifier.citation한국재료학회지, v. 25, NO 9, Page. 462-467en_US
dc.identifier.issn1225-0562-
dc.identifier.issn2287-7258-
dc.identifier.urihttp://journal.mrs-k.or.kr/journal/article.php?code=34648-
dc.identifier.urihttp://hdl.handle.net/20.500.11754/27696-
dc.description.abstractPellicle is defined as a thin transparent film stretched over an aluminum (Al) frame that is glued on one side of a photomask. As semiconductor devices are pursuing higher levels of integration and higher resolution patterns, the cleaning of the Al flame surface is becoming a critical step because the contaminants on the Al flame can cause lithography exposure defects on the wafers. In order to remove these contaminants from the Al frame, a highly concentrated nitric acid (HNO3) solution is used. However, it is difficult to fully remove them, which results in an increase in the Al surface roughness. In this paper, the pellicle frame cleaning is investigated using various cleaning solutions. When the mixture of sulfuric acid (H2SO4), hydrofluoric acid (HF), hydrogen peroxide (H2O2), and deionized water with ultrasonic is used, a high cleaning efficiency is achieved without HNO3. Thus, this cleaning process is suitable for Al frame cleaning and it can also reduce the use of chemicals.en_US
dc.description.sponsorshipThis work was supported by the Future Semiconductor Device Technology Development Program #10045366 funded By MOTIE(Ministry of Trade, Industry & Energy) and KSRC(Korea Semiconductor Research Consortium).en_US
dc.language.isoko_KRen_US
dc.publisher한국재료학회en_US
dc.subjectlithographyen_US
dc.subjectphotomasken_US
dc.subjectpellicleen_US
dc.subjectaluminum alloysen_US
dc.subjectSMUTen_US
dc.subjectultrasonic cleaningen_US
dc.title포토마스크 펠리클 제조를 위한 Aluminum Frame 표면 세정공정 연구en_US
dc.title.alternativeStudy on Aluminum Frame Surface Cleaning Process for Photomask Pellicle Fabricationen_US
dc.typeArticleen_US
dc.relation.no9-
dc.relation.volume25-
dc.identifier.doi10.3740/MRSK.2015.25.9.462-
dc.relation.page462-467-
dc.relation.journal한국재료학회지-
dc.contributor.googleauthor김현태-
dc.contributor.googleauthor김향란-
dc.contributor.googleauthor김민수-
dc.contributor.googleauthor이준-
dc.contributor.googleauthor장성해-
dc.contributor.googleauthor최인찬-
dc.contributor.googleauthor박진구-
dc.contributor.googleauthorKim, Hyun-Tae-
dc.contributor.googleauthorKim, Hyang-Ran-
dc.contributor.googleauthorKim, Min-Su-
dc.contributor.googleauthorLee, Jun-
dc.contributor.googleauthorJang, Sung-Hae-
dc.contributor.googleauthorChoi, In-Chan-
dc.contributor.googleauthorPark, Jin-Goo-
dc.relation.code2015040900-
dc.sector.campusS-
dc.sector.daehakGRADUATE SCHOOL[S]-
dc.sector.departmentDEPARTMENT OF BIONANOTECHNOLOGY-
dc.identifier.pidjgpark-


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