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Apparatus for electronic component disassembly from printed circuit board assembly in e-wastes

Title
Apparatus for electronic component disassembly from printed circuit board assembly in e-wastes
Author
박재구
Keywords
Printed circuit board assembly; Electronic components; Disassembly process; Recycling; E-wastes
Issue Date
2015-09
Publisher
ELSEVIER SCIENCE BV
Citation
INTERNATIONAL JOURNAL OF MINERAL PROCESSING, v. 144, Page. 11-15
Abstract
The current study involves the development of an electronic component (EC) disassembly apparatus for printed circuit board assembly (PCBA) in the pretreatment processing of electronic waste recycling. In the apparatus, the PCBA is fed slowly into the disassembly module and is then heated via infra-red heater over the melting point of the solder which bonds the PCB and ECs. The ECs are swept off from the PCB with the use of rotating steel brush rods. Then, the ECs on both sides of the boards are removed simultaneously. The maximum disassembly ratio (94%) is obtained at a feeding speed of 0.33 cm/s and a heating temperature of 250 degrees C. (C) 2015 Elsevier B.V. All rights reserved.
URI
http://www.sciencedirect.com/science/article/pii/S0301751615300302http://hdl.handle.net/20.500.11754/27517
ISSN
0301-7516; 1879-3525
DOI
10.1016/j.minpro.2015.09.013
Appears in Collections:
COLLEGE OF ENGINEERING[S](공과대학) > EARTH RESOURCES AND ENVIRONMENTAL ENGINEERING(자원환경공학과) > Articles
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