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Anisotropic viscoelastic shell modeling technique of copper patterns/photoimageable solder resist composite for warpage simulation of multi-layer printed circuit boards

Title
Anisotropic viscoelastic shell modeling technique of copper patterns/photoimageable solder resist composite for warpage simulation of multi-layer printed circuit boards
Author
김학성
Keywords
printed circuit board (PCB); warpage simulation; viscoelastic property; anisotropic shell model
Issue Date
2015-09
Publisher
IOP PUBLISHING LTD
Citation
JOURNAL OF MICROMECHANICS AND MICROENGINEERING, v. 25, NO 10, Page. 1-12
Abstract
In this study, the warpage simulation of a multi-layer printed circuit board (PCB) was performed as a function of various copper (Cu) patterns/photoimageable solder resist (PSR) composite patterns and their anisotropic viscoelastic properties. The thermo-mechanical properties of Cu/PSR patterns were obtained from finite element analysis (virtual test) and homogenized with anisotropic composite shell models that considered the viscoelastic properties. The multi-layer PCB model was simplified based on the unit Cu/PSR patterns and the warpage simulation during the reflow process was performed by using ABAQUS combined with a user-defined subroutine. From these results, it was demonstrated that the proposed anisotropic viscoelastic composite shell simulation technique can be successfully used to predict warpage of multi-layer PCBs during the reflow process.
URI
http://iopscience.iop.org/article/10.1088/0960-1317/25/10/105016/meta;jsessionid=4937AFFAFA71E8A7C3D9EE8B2052C469.ip-10-40-1-105http://hdl.handle.net/20.500.11754/27485
ISSN
0960-1317; 1361-6439
DOI
10.1088/0960-1317/25/10/105016
Appears in Collections:
COLLEGE OF ENGINEERING[S](공과대학) > MECHANICAL ENGINEERING(기계공학부) > Articles
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