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dc.contributor.author김학성-
dc.date.accessioned2017-05-29T01:00:27Z-
dc.date.available2017-05-29T01:00:27Z-
dc.date.issued2015-09-
dc.identifier.citationJOURNAL OF MICROMECHANICS AND MICROENGINEERING, v. 25, NO 10, Page. 1-12en_US
dc.identifier.issn0960-1317-
dc.identifier.issn1361-6439-
dc.identifier.urihttp://iopscience.iop.org/article/10.1088/0960-1317/25/10/105016/meta;jsessionid=4937AFFAFA71E8A7C3D9EE8B2052C469.ip-10-40-1-105-
dc.identifier.urihttp://hdl.handle.net/20.500.11754/27485-
dc.description.abstractIn this study, the warpage simulation of a multi-layer printed circuit board (PCB) was performed as a function of various copper (Cu) patterns/photoimageable solder resist (PSR) composite patterns and their anisotropic viscoelastic properties. The thermo-mechanical properties of Cu/PSR patterns were obtained from finite element analysis (virtual test) and homogenized with anisotropic composite shell models that considered the viscoelastic properties. The multi-layer PCB model was simplified based on the unit Cu/PSR patterns and the warpage simulation during the reflow process was performed by using ABAQUS combined with a user-defined subroutine. From these results, it was demonstrated that the proposed anisotropic viscoelastic composite shell simulation technique can be successfully used to predict warpage of multi-layer PCBs during the reflow process.en_US
dc.description.sponsorshipThis work was supported by SAMSUNG Electronics (No 201300000000305) and the National Research Foundation of Korea (NRF) funded by the Ministry of Education (No 2012R1A6A1029029 and No 2013M2A2A9043280). Also, this work was supported by the Technology Innovation Program (or Industrial Strategic technology development program, 10048913, Development of the cheap nano-ink which is sintered in the air for smart devices) funded By the Ministry of Trade, Industry and Energy (MI, Korea).en_US
dc.language.isoenen_US
dc.publisherIOP PUBLISHING LTDen_US
dc.subjectprinted circuit board (PCB)en_US
dc.subjectwarpage simulationen_US
dc.subjectviscoelastic propertyen_US
dc.subjectanisotropic shell modelen_US
dc.titleAnisotropic viscoelastic shell modeling technique of copper patterns/photoimageable solder resist composite for warpage simulation of multi-layer printed circuit boardsen_US
dc.typeArticleen_US
dc.relation.no10-
dc.relation.volume25-
dc.identifier.doi10.1088/0960-1317/25/10/105016-
dc.relation.page1-12-
dc.relation.journalJOURNAL OF MICROMECHANICS AND MICROENGINEERING-
dc.contributor.googleauthorKim, Do-Hyoung-
dc.contributor.googleauthorJoo, Sung-Jun-
dc.contributor.googleauthorKwak, Dong-Ok-
dc.contributor.googleauthorKim, Hak-Sung-
dc.relation.code2015000640-
dc.sector.campusS-
dc.sector.daehakCOLLEGE OF ENGINEERING[S]-
dc.sector.departmentDIVISION OF MECHANICAL ENGINEERING-
dc.identifier.pidkima-
Appears in Collections:
COLLEGE OF ENGINEERING[S](공과대학) > MECHANICAL ENGINEERING(기계공학부) > Articles
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