239 0

Non-destructive evaluation of the hidden voids in integrated circuit packages using terahertz time-domain spectroscopy

Title
Non-destructive evaluation of the hidden voids in integrated circuit packages using terahertz time-domain spectroscopy
Author
김학성
Keywords
non-destructive; terahertz; void; IC package; detection
Issue Date
2015-08
Publisher
IOP PUBLISHING LTD
Citation
JOURNAL OF MICROMECHANICS AND MICROENGINEERING, v. 25, NO 9, Page. 1-9
Abstract
In this work, a terahertz time-domain spectroscopy (THz-TDS) imaging technique was used as a non-destructive inspection method for detecting voids in integrated circuit (IC) packages. Transmission and reflection modes, with an angle of incidence of 30 degrees, were used to detect voids in IC packages. The locations of the detected voids in the IC packages could be calculated by analyzing THz waveforms. Finally, voids that are positioned at the different interfaces in the IC package samples could be successfully detected and imaged. Therefore, this THz-TDS imaging technique is expected to be a promising technique for non-destructive evaluation of IC packages.
URI
http://iopscience.iop.org/article/10.1088/0960-1317/25/9/095007/metahttp://hdl.handle.net/20.500.11754/26909
ISSN
0960-1317; 1361-6439
DOI
10.1088/0960-1317/25/9/095007
Appears in Collections:
COLLEGE OF ENGINEERING[S](공과대학) > MECHANICAL ENGINEERING(기계공학부) > Articles
Files in This Item:
There are no files associated with this item.
Export
RIS (EndNote)
XLS (Excel)
XML


qrcode

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.

BROWSE