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CMUTS IN PERMANENT CONTACT OPERATION FOR HIGH OUTPUT PRESSURE

Title
CMUTS IN PERMANENT CONTACT OPERATION FOR HIGH OUTPUT PRESSURE
Author
박관규
Keywords
Pressure
Issue Date
2015-07
Publisher
ASME
Citation
ASME Proceedings | MEMS and NEMS, Page. 1-4
Abstract
We present the operation of capacitive micromachined ultrasonic transducers (CMUTs) in permanent contact mode as an efficient transducer. The gap height of our transducers is chosen to be slightly smaller than the static deflection of the plate due to the pressure difference between the ambient and the vacuum cavity. Thus, the plates are in contact with the bottom of the cavities even with no dc bias applied. The devices were fabricated based on the thick box process. High-temperature assisted direct wafer bonding technique was used to fabricate devices with such large cell size (radii ∼ 2000 μm) featuring low frequencies ∼100–150 kHz. Extensive acoustic characterization was performed to demonstrate the behavior of such CMUTs in terms of displacement profile, output pressure and acoustic pitch-catch response. A maximum sound pressure of ∼145 dB (SPL) at the transducer surface is measured at 240 V dc and 10 V ac with 100 cycles of burst signal. This is a great improvement from conventional CMUTs (with deeper gap height, operating at 55 kHz), which requires 350 V dc and 200 V ac in order to achieve an output pressure of 129 dB (SPL) at the transducer surface. The results presented in this paper demonstrate that operating CMUTs in permanent contact mode indeed enhances the device output pressure, and provides a good candidate for efficient ultrasonic transducers. Copyright © 2015 by ASME
Description
ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays San Francisco, California, USA, July 6–9, 2015
URI
http://proceedings.asmedigitalcollection.asme.org/proceeding.aspx?articleid=2472684http://hdl.handle.net/20.500.11754/26408
ISBN
978-0-7918-5690-1
DOI
10.1115/IPACK2015-48733
Appears in Collections:
COLLEGE OF ENGINEERING[S](공과대학) > MECHANICAL ENGINEERING(기계공학부) > Articles
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