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dc.contributor.author박진구-
dc.date.accessioned2017-02-27T00:15:16Z-
dc.date.available2017-02-27T00:15:16Z-
dc.date.issued2015-06-
dc.identifier.citationWEAR, v. 332, NO Special SI, Page. 794-799en_US
dc.identifier.issn0043-1648-
dc.identifier.issn1873-2577-
dc.identifier.urihttp://www.sciencedirect.com/science/article/pii/S0043164815001386-
dc.identifier.urihttp://hdl.handle.net/20.500.11754/25676-
dc.description.abstractLapping for sapphire substrates was evaluated with respect to material removal modes. Firstly, a 3-body removal mode that consists of diamond slurry and a metal-resin platen was tested. The metal-resin platen was produced by mixing metal particles (Cu, Al, and Sn) and resin. Secondly, we analyzed a 2-body system using a fixed diamond abrasive pad with a low concentration of alumina slurry as a dressing for the pad surface. For each lapping process, we examined the function of the diamond abrasive particles. The fundamental characteristics of each process were observed to suggest optimal conditions for sapphire processing for various applications. (C) 2015 Elsevier B.V. All rights reserved.en_US
dc.description.sponsorshipThis work was supported by the Future Semiconductor Device Technology Development Program 10045366 funded by MOTIE (Ministry of Trade, Industry & Energy) and KSRC (Korea Semiconductor Research Consortium).en_US
dc.language.isoenen_US
dc.publisherELSEVIER SCIENCE SAen_US
dc.subjectLappingen_US
dc.subjectSapphireen_US
dc.subjectFixed abrasive paden_US
dc.subjectDiamonden_US
dc.subjectMetal-resin platenen_US
dc.titleComparison between sapphire lapping processes using 2-body and 3-body modes as a function of diamond abrasive sizeen_US
dc.typeArticleen_US
dc.relation.noSpecial SI-
dc.relation.volume332-
dc.identifier.doi10.1016/j.wear.2015.02.029-
dc.relation.page794-799-
dc.relation.journalWEAR-
dc.contributor.googleauthorKim, Hyuk-Min-
dc.contributor.googleauthorPark, Gun-Ho-
dc.contributor.googleauthorSeo, Young-Gil-
dc.contributor.googleauthorMoon, Deog-Ju-
dc.contributor.googleauthorCho, Byoung-Jun-
dc.contributor.googleauthorPark, Jin-Goo-
dc.relation.code2015001231-
dc.sector.campusS-
dc.sector.daehakGRADUATE SCHOOL[S]-
dc.sector.departmentDEPARTMENT OF BIONANOTECHNOLOGY-
dc.identifier.pidjgpark-
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GRADUATE SCHOOL[S](대학원) > BIONANOTECHNOLOGY(바이오나노학과) > Articles
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