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dc.contributor.author김영호-
dc.date.accessioned2016-10-28T01:53:13Z-
dc.date.available2016-10-28T01:53:13Z-
dc.date.issued2015-04-
dc.identifier.citationSCRIPTA MATERIALIA, v. 104, Page. 21-24en_US
dc.identifier.issn1359-6462-
dc.identifier.urihttp://www.sciencedirect.com/science/article/pii/S1359646215001220-
dc.identifier.urihttp://hdl.handle.net/20.500.11754/23972-
dc.description.abstractEnhanced direct Cu/Cu joining by applying current was investigated. Joining was conducted at 240-300 degrees C for 10-50 min under 40 MPa. Current was applied to Cu wire during joining. Contact resistance of joints decreased and the fracture load of joints increased as the current increased. The joined region increased and the interface became less straight as the current increased. These results are ascribed to electromigration and joule heating effects. The enhanced diffusion contributed significantly to the joining of metals. (C) 2015 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.en_US
dc.description.sponsorshipThis research was financially supported by SK Hynix semiconductors.en_US
dc.language.isoenen_US
dc.publisherPERGAMON-ELSEVIER SCIENCE LTDen_US
dc.subjectJoiningen_US
dc.subjectElectromigrationen_US
dc.subjectJoule heatingen_US
dc.subjectCu/Cu directen_US
dc.titleCurrent-assisted direct Cu/Cu joiningen_US
dc.typeArticleen_US
dc.relation.volume104-
dc.identifier.doi10.1016/j.scriptamat.2015.03.016-
dc.relation.page21-24-
dc.relation.journalSCRIPTA MATERIALIA-
dc.contributor.googleauthorShin, Chanho-
dc.contributor.googleauthorMa, Sung Woo-
dc.contributor.googleauthorLee, Jeong Hwan-
dc.contributor.googleauthorKim, Ki Bum-
dc.contributor.googleauthorSuh, Minsuk-
dc.contributor.googleauthorKim, Namseog-
dc.contributor.googleauthorKim, Young-Ho-
dc.relation.code2015001972-
dc.sector.campusS-
dc.sector.daehakCOLLEGE OF ENGINEERING[S]-
dc.sector.departmentDIVISION OF MATERIALS SCIENCE AND ENGINEERING-
dc.identifier.pidkimyh-
Appears in Collections:
COLLEGE OF ENGINEERING[S](공과대학) > MATERIALS SCIENCE AND ENGINEERING(신소재공학부) > Articles
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