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dc.contributor.author정재원-
dc.date.accessioned2016-08-11T00:43:00Z-
dc.date.available2016-08-11T00:43:00Z-
dc.date.issued2015-02-
dc.identifier.citationAPPLIED THERMAL ENGINEERING, v. 77, Page. 163-179en_US
dc.identifier.issn1359-4311-
dc.identifier.urihttp://www.sciencedirect.com/science/article/pii/S1359431114011508-
dc.identifier.urihttp://hdl.handle.net/20.500.11754/22500-
dc.description.abstractIn order to reduce data center cooling energy, ASHRAE Technical Committee 9.9 expanded thermal environmental ranges for data centers and recommended using the economizer, and it has reduced data center cooling energy successfully. The main purpose of this research is to establish an energy optimization process for the air-side economizer in a modular data center with respect to various parameters (supply air conditions, server thermal characteristics, cooling system configurations, and heat exchange effectiveness), and to determine optimum supply air ranges through simulation. The cooling energy simulation is conducted for three types of air-side economizers by changing the supply air temperature (SAT) and heat exchanger effectiveness at 16 locations in South Korea based on the three thermal environmental ranges. The simulation result shows that the lowest cooling energy consumption appears when the computer room air handler (CRAH) SAT is within 18-23 degrees C, and at higher SAT conditions, the cooling energy consumption increases, since chiller energy reduction is offset by the increase in CRAH fan energy. (C) 2014 Elsevier Ltd. All rights reserved.en_US
dc.description.sponsorshipNational Research Foundation of Korea (NRF) - Korean governmen Korea Evaluation Institute of Industrial Technology - Korean Governmenten_US
dc.language.isoenen_US
dc.publisherPERGAMON-ELSEVIER SCIENCE LTDen_US
dc.subjectModular data centeren_US
dc.subjectAir-side economizeren_US
dc.subjectOptimum supply air temperature rangesen_US
dc.subjectEnergy simulationen_US
dc.titleOptimum supply air temperature ranges of various air-side economizers in a modular data centeren_US
dc.typeArticleen_US
dc.relation.volume77-
dc.identifier.doi10.1016/j.applthermaleng.2014.12.021-
dc.relation.page163-179-
dc.relation.journalAPPLIED THERMAL ENGINEERING-
dc.contributor.googleauthorHam, Sang-Woo-
dc.contributor.googleauthorPark, Jun-Seok-
dc.contributor.googleauthorJeong, Jae-Weon-
dc.relation.code2015005714-
dc.sector.campusS-
dc.sector.daehakCOLLEGE OF ENGINEERING[S]-
dc.sector.departmentDEPARTMENT OF ARCHITECTURAL ENGINEERING-
dc.identifier.pidjjwarc-
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COLLEGE OF ENGINEERING[S](공과대학) > ARCHITECTURAL ENGINEERING(건축공학부) > Articles
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