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dc.contributor.author박준홍-
dc.date.accessioned2016-07-27T01:28:00Z-
dc.date.available2016-07-27T01:28:00Z-
dc.date.issued2015-02-
dc.identifier.citationJOURNAL OF MICROMECHANICS AND MICROENGINEERING, v. 25, NO 3, Page. 1-9en_US
dc.identifier.issn0960-1317-
dc.identifier.issn1361-6439-
dc.identifier.urihttp://iopscience.iop.org/article/10.1088/0960-1317/25/3/035021/meta-
dc.identifier.urihttp://hdl.handle.net/20.500.11754/22261-
dc.description.abstractWoven glass fabric/BT (bismaleimide triazine) composite laminate (BT core), copper (Cu), and photoimageable solder resist (PSR) are the most widely used materials for semiconductors in electronic devices. Among these materials, BT core and PSR contain polymeric materials that exhibit viscoelastic behavior. For this reason, these materials are considered to have time-and temperature-dependent moduli during warpage analysis. However, the thin geometry of multilayer printed circuit board (PCB) film makes it difficult to identify viscoelastic characteristics. In this work, a vibration test method was proposed for measuring the viscoelastic properties of a multilayer PCB film at different temperatures. The beam-shaped specimens, composed of a BT core, Cu laminated on a BT core, and PSR and Cu laminated on a BT core, were used in the vibration test. The frequency-dependent variation of the complex bending stiffness was determined using a transfer function method. The storage modulus (E') of the BT core, Cu, and PSR as a function of temperature and frequency were obtained, and their temperature-dependent variation was identified. The obtained properties were fitted using a viscoelastic model for the BT core and the PSR, and a linear elastic model for the Cu. Warpage of a line pattern specimen due to temperature variation was measured using a shadow Moire analysis and compared to predictions using a finite element model. The results provide information on the mechanism of warpage, especially warpage due to temperature-dependent variation in viscoelastic properties.en_US
dc.description.sponsorshipTechnology Innovation Program - Ministry of Trade, Industry and Energy (MI, Korea) National Research Foundation of Korea (NRF) grant - Korea Government (MEST) Basic Science Research Program through the National Research Foundation of Korea (NRF) - Ministry of Educationen_US
dc.language.isoenen_US
dc.publisherIOP PUBLISHING LTDen_US
dc.subjecta vibration methoden_US
dc.subjecttransfer function methoden_US
dc.subjectviscoelastic propertyen_US
dc.subjectmultilayer PCB filmen_US
dc.subjectwarapge of PCBen_US
dc.titleInvestigation of multilayer printed circuit board (PCB) film warpage using viscoelastic properties measured by a vibration testen_US
dc.typeArticleen_US
dc.relation.no3-
dc.relation.volume25-
dc.identifier.doi10.1088/0960-1317/25/3/035021-
dc.relation.page1-9-
dc.relation.journalJOURNAL OF MICROMECHANICS AND MICROENGINEERING-
dc.contributor.googleauthorJoo, Sung-Jun-
dc.contributor.googleauthorPark, Buhm-
dc.contributor.googleauthorKim, Do-Hyoung-
dc.contributor.googleauthorKwak, Dong-Ok-
dc.contributor.googleauthorSong, In-Sang-
dc.contributor.googleauthorPark, Junhong-
dc.contributor.googleauthorKim, Hak-Sung-
dc.relation.code2015000640-
dc.sector.campusS-
dc.sector.daehakCOLLEGE OF ENGINEERING[S]-
dc.sector.departmentDIVISION OF MECHANICAL ENGINEERING-
dc.identifier.pidparkj-
Appears in Collections:
COLLEGE OF ENGINEERING[S](공과대학) > MECHANICAL ENGINEERING(기계공학부) > Articles
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