Characterization of Cu-BTA Organic Complexes on Cu during Cu CMP and Post Cu Cleaning
- Title
- Characterization of Cu-BTA Organic Complexes on Cu during Cu CMP and Post Cu Cleaning
- Other Titles
- Ultra Clean Processing of Semiconductor Surfaces XII
- Author
- 박진구
- Keywords
- contact angle; Cu-BTA complex; cupric & cuprous oxide; electrochemical impedance spectroscopy
- Issue Date
- 2015-01
- Publisher
- Scitec Publications Ltd.
- Citation
- Diffusion and Defect Data Pt.B: Solid State Phenomena, v. 219, Page. 205-208
- Abstract
- Although copper have better electrical properties than aluminum such as low resistivity and high electro-migration resistivity, aluminum has been used as an interconnect material due to the difficulty in Cu dry etching. Since CMP process has been adapted to the semiconductor fabrication, Cu became the choice of materials for interconnection. However, copper CMP process introduces new defects on the surface such as slurry particle, organic residue, scratch and corrosion.
- URI
- http://hdl.handle.net/20.500.11754/21444https://www.scientific.net/SSP.219.205
- ISBN
- 978-3038352426
- DOI
- 10.4028/www.scientific.net/SSP.219.205
- Appears in Collections:
- GRADUATE SCHOOL[S](대학원) > BIONANOTECHNOLOGY(바이오나노학과) > Articles
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