Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 박지영 | - |
dc.date.accessioned | 2024-04-22T04:20:13Z | - |
dc.date.available | 2024-04-22T04:20:13Z | - |
dc.date.issued | 2023-05-01 | - |
dc.identifier.citation | JOURNAL OF THE AMERICAN CERAMIC SOCIETY, v. 106, NO 12, Page. 7240-7250 | en_US |
dc.identifier.issn | 1551-2916 | en_US |
dc.identifier.issn | 0002-7820 | en_US |
dc.identifier.uri | https://information.hanyang.ac.kr/#/eds/detail?an=edselc.2-52.0-85163051654&dbId=edselc | en_US |
dc.identifier.uri | https://repository.hanyang.ac.kr/handle/20.500.11754/189913 | - |
dc.description.abstract | In recent times, electronics have been increasingly minimized, and hence, heat dissipation has become essential. Owing to its high thermal conductivity and superior electrical insulation, hexagonal-boron nitride (h-BN) has been regarded as an appropriate ceramic material to increase the thermal conductivity of polymer nanocomposites for effective heat dissipation. However, the poor through-plane thermal conductivity of h-BN severely restricts its practical uses, and it is favorable for heat to radiates in the in-plane direction. In this study, densified spherical h-BN (sph-BN) microspheres, composed of as-synthesized nano-sized h-BN (nano-BN), were manufactured by a spray-drying process with variations in organic and/or inorganic binders followed by sintering. After incorporating various sph-BN particles as fillers into polydimethylsiloxane (PDMS), the through-plane thermal conductivity of composites embedded with sph-BN, assisted by a sodium silicate binder, enhanced the highest through-plane and in-plane thermal conductivities. The composites exhibited high thermal isotropy (through-plane thermal conductivity/in-plane thermal conductivity: lambda perpendicular to/lambda//${\lambda }_ \bot /{\lambda }_{//}$) of 0.77. The out-of-plane thermal conductivity of the composites was remarkably enhanced by over 2000% compared with pristine PDMS, which can be attributed to the synergy combined with the synthesis of the densified spherical BN initiated by nano-BN, sintering, and the application of inorganic binders. This study proposes a simple method to prepare polymer composites with h-BN that exhibit high through-plane thermal conductivity and are promising materials for heat removal in electronics. | en_US |
dc.description.sponsorship | This work was supported by Nano⋅Material TechnologyDevelopment Program through the National ResearchFoundation of Korea (NRF) funded by Ministry of Sci-enceandICT (No.2022M3H4A3082849)andthiswork wassupported by the Industrial Strategic Technology Devel-opment Program (20010501, Development of Guide Platefor AP Probe Card and MLA Board for DRAM Probe CardUsing by AAO Substrate) funded By the Ministry of Trade,Industry & Energy (MOTIE, Korea). | en_US |
dc.language | en_US | en_US |
dc.publisher | WILEY | en_US |
dc.relation.ispartofseries | v. 106, NO 12;7240-7250 | - |
dc.subject | hexagonal-boron nitride | en_US |
dc.subject | polymer nanocomposites | en_US |
dc.subject | spray-dry process | en_US |
dc.subject | through-plane thermal conductivity | en_US |
dc.title | Preparation of h-BN microspheres for nanocomposites with high through-plane thermal conductivity | en_US |
dc.type | Article | en_US |
dc.relation.no | 12 | - |
dc.relation.volume | 106 | - |
dc.identifier.doi | 10.1111/jace.19219 | en_US |
dc.relation.page | 7240-7250 | - |
dc.relation.journal | JOURNAL OF THE AMERICAN CERAMIC SOCIETY | - |
dc.contributor.googleauthor | Mun, Hyung Jin | - |
dc.contributor.googleauthor | Park, Ji Young | - |
dc.contributor.googleauthor | Lim, Minseob | - |
dc.contributor.googleauthor | Cho, Hong-Baek | - |
dc.contributor.googleauthor | Choa, Yong-Ho | - |
dc.relation.code | 2023035455 | - |
dc.sector.campus | E | - |
dc.sector.daehak | EXECUTIVE VICE PRESIDENT FOR ERICA[E] | - |
dc.sector.department | INSTITUTE FOR ERICA CONVERGENCE | - |
dc.identifier.pid | jiyoung3073 | - |
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