Development of the multi-layer fabrication process for low-profile transducer and advanced packaging

Abstract

The field of industrial development has seen remarkable progress in recent years, particularly in the realm of acoustic signal detection technologies. This advancement has sparked a surge in the use of acoustic signal concealment methods in various environments, most notably underwater. The development and application of stealth technology are crucial in such settings, primarily to detect and prevent potential collisions between large moving objects beneath the ocean's surface. These scenarios pose significant risks, making the continuous advancement and research in echo detection technology a high priority to ensure safety and efficiency in marine navigation and exploration. A key component in echo detection systems is the use of transducers. These devices are essential in transmitting and receiving signals, with each transducer characterized by its unique resonant frequency and bandwidth. Choosing the right transducer is vital for specific applications, given the diversity in their resonant frequencies and bandwidths. Recent studies have been geared towards designing and evaluating transducers specifically tailored for managing echoes from oblique incidences. The design of these state-of-the-art transducers involves an integrated receiving layer capable of distinguishing between incident and reflected sounds. Additionally, they feature a transmitting element engineered to disperse sound waves omnidirectionally. These innovations in transducer technology have proven to be highly effective, demonstrating the ability to handle both normal and oblique incidences with significant signal reduction capabilities, often exceeding -20 dB. Moreover, the research has not only been limited to the development of new transducer designs but also extends to addressing potential challenges in redistribution layer processes. A notable advancement in this area is the exploration of rewiring layer processes, particularly in the context of 2.xD advanced packaging. A novel approach involving the use of photo-imageable dielectric film for the design of redistribution layers has been developed. This process entails several key steps, including the lamination of the photo- imageable dielectric film, followed by intricate patterning and plating procedures. Through a meticulous multi-layer process on a substrate, it is possible to extract only the top layer, which is crucial for the intended application. The implications of these advancements are far-reaching. The combination of photo- imageable dielectric film and copper, as derived from this process, is anticipated to have significant applications, especially in the development of flexible electrode connections. These could be utilized in a myriad of fields, ranging from marine exploration to sophisticated electronic devices, opening new frontiers in both industrial and technological domains. The continuous exploration and improvement in these areas highlight the dynamic nature of technological advancement and its pivotal role in shaping various aspects of modern life, particularly in enhancing safety and efficiency in complex environments like the deep sea.