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dc.contributor.advisor구자윤-
dc.contributor.author윤호중-
dc.date.accessioned2024-03-01T07:32:29Z-
dc.date.available2024-03-01T07:32:29Z-
dc.date.issued2014.2-
dc.identifier.urihttp://hanyang.dcollection.net/common/orgView/200000423308en_US
dc.identifier.urihttps://repository.hanyang.ac.kr/handle/20.500.11754/188221-
dc.description.abstractSincelastthreedecades,polymerinsulatorshavebeenwidelyinstalledintoACpowergridascribedtotheimprovedelectrical,thermal,andmechanicalpropertiesofpolymermaterials.Inparticular,80%ofnewlyinstalledinsulatorhasadoptedsiliconecompositesbasedontherelatedresearchesbringingaboutapprovedprogressforitsapplicationtoACorDCpowergrid.AccordingtotheexpansionofHVDCgridovertheworld,manyresearchinstituteshaveputtheirintensiveeffortstodevelopsiliconecompositeinsulatorsfortheircommercialapplication.However,veryfewreportshavebeendisclosedfortheinsulationpropertiesofsiliconecompositeunderDCstress.Inthiswork,theanalysisonthevolumeconductivityandDCbreakdownhasbeendonebyuseofsiliconecompositespecimenunderdifferentleveloftemperature.Forthispurpose,experimentalinvestigationhasbeencarriedoutasfollows:forbreakdownstrengthunderDCstressandforvolumeconductivitybymeasuringleakagecurrentunderDC.TheresultswouldbeemployedasoneofthedesignparametersfortheirapplicationtoHVDCgridat500kV-
dc.publisher한양대학교-
dc.titleHVDC500kV폴리머애자의절연재료특성에대한연구-
dc.title.alternativeAstudyofinsulationmaterialusedforHVDC500kVinsulator-
dc.typeTheses-
dc.contributor.googleauthor윤호중-
dc.contributor.alternativeauthorHojungYoon-
dc.sector.campusS-
dc.sector.daehak대학원-
dc.sector.department전자시스템공학과-
dc.description.degreeMaster-
Appears in Collections:
GRADUATE SCHOOL[S](대학원) > ELECTRONIC SYSTEMS ENGINEERING(전자시스템공학과) > Theses (Master)
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