Influence of C4F8 plasma treatment on size control of inkjet-printed dots on a flexible substrate
- Title
- Influence of C4F8 plasma treatment on size control of inkjet-printed dots on a flexible substrate
- Author
- 오제훈
- Keywords
- Inkjet printing; Plasma treatment; Surface wettability; Surface characterization; Response surface method
- Issue Date
- 2010-12
- Publisher
- ELSEVIER SCIENCE SA
- Citation
- SURFACE & COATINGS TECHNOLOGY, v. 205, NO. SUPPL. 1, Page. S158-S163
- Abstract
- The paper aims to investigate the influence of C4F8 plasma treatment on the inkjet-printed dot sizes on flexible PI substrates using the response surface method. The whole experimental region of two independent variables was divided into a number of sub-domains to estimate the accurate relationship between the independent variables and the response. From the RSM analysis, desired dot diameters ranging from 30 mu m to 70 mu m could be obtained by selecting the proper combination of the RF power and gas pressure. The chemical and physical changes in plasma-treated surfaces were also characterized by contact angle measurements, scanning electron microscopy, atomic force microscopy and X-ray photoelectron spectroscopy. The results show that both RF power and gas pressure have a significant influence on the dot diameter. In some experimental region, well-defined dots cannot be produced due to unstable plasmas. The dot diameters on the plasma-treated surfaces are well correlated with the contact angles on them. The roughness and F/C ratio of surfaces are also affected by the plasma treatment. The plasma condition yielding higher F content results in more hydrophobic surfaces. (C) 2010 Elsevier B.V. All rights reserved.
- URI
- https://www.sciencedirect.com/science/article/pii/S0257897210005207?via%3Dihubhttps://repository.hanyang.ac.kr/handle/20.500.11754/183675
- ISSN
- 0257-8972;1879-3347
- DOI
- 10.1016/j.surfcoat.2010.07.010
- Appears in Collections:
- COLLEGE OF ENGINEERING SCIENCES[E](공학대학) > MECHANICAL ENGINEERING(기계공학과) > Articles
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