A 50-MHz Fully Integrated Low-Swing Buck Converter Using Packaging Inductors

Title
A 50-MHz Fully Integrated Low-Swing Buck Converter Using Packaging Inductors
Author
노정진
Keywords
Bonding wire; fully integrated dc-dc converter; lead frame; low-swing gate driver; packaging inductor
Issue Date
2012-10
Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Citation
IEEE TRANSACTIONS ON POWER ELECTRONICS, v. 27, NO. 10, Page. 4347-4356
Abstract
Implementation of on-chip passive elements and efficient regulation schemes are key aspects of fully integrated dc-dc converter design. This paper presents a 50-MHz fully integrated buck converter equipped with packaging inductors. These inductors include parasitic inductances of the bonding wires and lead frames in the package. They have significantly better Q factors than the best on-chip inductors implemented on silicon. This paper also presents full-swing and low-swing gate drivers for efficient regulation of high-frequency switching converters. The low-swing driver uses the drop voltage of a diode-connected transistor and is applied in a fabricated converter to reduce the gate driving loss caused by the high switching operation. The proposed converter is designed and fabricated using a 0.13-mu m 1-poly 6-metal CMOS process. The fully integrated buck converter achieves 68.7% and 76.8% efficiency for 3.3 V/2.0 V and 2.5 V/1.8 V conversions, respectively, while providing a load current of 250 mA.
URI
https://ieeexplore.ieee.org/document/6175983https://repository.hanyang.ac.kr/handle/20.500.11754/183411
ISSN
0885-8993;1941-0107
DOI
10.1109/TPEL.2012.2192136
Appears in Collections:
COLLEGE OF ENGINEERING SCIENCES[E](공학대학) > ELECTRICAL ENGINEERING(전자공학부) > Articles
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