Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 박진구 | - |
dc.date.accessioned | 2023-05-24T01:12:42Z | - |
dc.date.available | 2023-05-24T01:12:42Z | - |
dc.date.issued | 2012-09 | - |
dc.identifier.citation | Korean Journal of Materials Research, v. 22, NO. 9, Page. 482-488 | - |
dc.identifier.issn | 1225-0562;2287-7258 | - |
dc.identifier.uri | http://koreascience.or.kr/article/JAKO201228449926407.page | en_US |
dc.identifier.uri | https://repository.hanyang.ac.kr/handle/20.500.11754/181216 | - |
dc.description.abstract | To fabricate a precise micro metal mold, the electrochemical etching process has been researched. We investigated the electrochemical etching process numerically and experimentally to determine the etching tendency of the process, focusing on the current density, which is a major parameter of the process. The finite element method, a kind of numerical analysis,was used to determine the current density distribution on the workpiece. Stainless steel(SS304) substrate with various sized square and circular array patterns as an anode and copper(Cu) plate as a cathode were used for the electrochemical experiments. A mixture of H2SO4, H3PO4, and DIW was used as an electrolyte. In this paper, comparison of the results from the experiment and the numerical simulation is presented, including the current density distribution and line profile from the simulation, and the etching profile and surface morphology from the experiment. Etching profile and surface morphology were characterized using a 3D-profiler and FE-SEM measurement. From a comparison of the data, it was confirmed that the current density distribution and the line profile of the simulation were similar to the surface morphology and the etching profile of the experiment, respectively. The current density is more concentrated at the vertex of the square pattern and circumference of the circular pattern. And, the depth of the etched area is proportional to the current density. | - |
dc.description.sponsorship | 본 연구는 2012년도 정부(교육과학기술부)의 재원으로 한국연구재단의 지원을 받아 수행된 기초연구사업(과제번호 : 2008-0061862) 및 지식경제부 유무기복합 대면적 나노구조체 제작 기술과제(과제번호: 10033871)의 일환으로 수행되었습니다. | - |
dc.language | ko | - |
dc.publisher | 한국재료학회 | - |
dc.subject | finite element simulation | - |
dc.subject | electrochemical etching | - |
dc.subject | TMEMM | - |
dc.subject | metal mold | - |
dc.title | 미세금형 가공을 위한 전기화학식각 공정의 유한요소 해석 및 실험결과 비교 | - |
dc.title.alternative | Finite Element Simulation and Experimental Study on the Electrochemical Etching Process for Fabrication of Micro Metal Mold | - |
dc.type | Article | - |
dc.relation.no | 9 | - |
dc.relation.volume | 22 | - |
dc.identifier.doi | 10.3740/MRSK.2012.22.9.482 | - |
dc.relation.page | 482-488 | - |
dc.relation.journal | Korean Journal of Materials Research | - |
dc.contributor.googleauthor | 류헌열 | - |
dc.contributor.googleauthor | 임현승 | - |
dc.contributor.googleauthor | 조시형 | - |
dc.contributor.googleauthor | 황병준 | - |
dc.contributor.googleauthor | 이성호 | - |
dc.contributor.googleauthor | 박진구 | - |
dc.sector.campus | E | - |
dc.sector.daehak | 공학대학 | - |
dc.sector.department | 재료화학공학과 | - |
dc.identifier.pid | jgpark | - |
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