Monolithic 3D Integration Process and Its Device Applications

Abstract

We have demonstrated the monolithic 3D integration (M3D) process and its applications to hybrid CMOS and photodiode device system as well as 3D neuromorphic device system. This M3D process was realized by both hydrogen ion (H+) implantation and Silicon-on-Insulator (SOI) wafer bonding with optimized various unit processes. Our result indicate that M3D integration process can be an alternative process integration scheme to the conventional 2D scaling process.