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A Hierarchical 3D Graphene Nanocomposite Foam for Extremely Tough, Non-Wettable, and Elastic Conductor

Title
A Hierarchical 3D Graphene Nanocomposite Foam for Extremely Tough, Non-Wettable, and Elastic Conductor
Author
박완준
Keywords
3D foam; conductive polymer composites; graphene foams; graphene nanocomposites; stretchable conductors
Issue Date
2020-07
Publisher
WILEY
Citation
ADVANCED MATERIALS INTERFACES, v. 7, no. 14, article no. 2000354
Abstract
Recently, stretchable conductors and electrodes with hierarchically 3D foams have been highlighted for the development of simple and cost-effective systems with enhanced performance in sensors, absorbents, energy storage devices, medical devices, and catalysts. For better versatility, additional properties such as mechanical robustness, water repellency, and thermal resistance are required for stable operation in tough, dry/wet conditions. Herein, a novel strategy is reported to fabricate highly robust and large-area foam-type conductor with a multiscale 3D matrix of a graphene/polymer nanocomposite (GNC) using a nickel-based template. The 3D foam conductor with hierarchically porous GNC structures presents excellent stretchability (˂160%), water repellency (contact angle ˃ 126 degrees), fire retardancy (˃400 degrees C), and shock-absorbing ability (˃300 kPa), enabling potential application as versatile conductors working under extreme environments. In addition, it is demonstrated that the 3D GNC foam conductor can be used for healthcare electrode operating in wet environments under mechanical bending strain. It is believed that this work overcomes the lack of versatility of conventional bulk or 3D conductive polymer composites and can pave the way for the development of high-performance, tough, and non-wettable conductor that can operate under extreme environments.
URI
https://onlinelibrary.wiley.com/doi/10.1002/admi.202000354https://repository.hanyang.ac.kr/handle/20.500.11754/169335
ISSN
2196-7350
DOI
10.1002/admi.202000354
Appears in Collections:
COLLEGE OF ENGINEERING[S](공과대학) > ELECTRONIC ENGINEERING(융합전자공학부) > Articles
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