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Mitigation of single-event effects in SiGe HBT current-mode logic circuits

Title
Mitigation of single-event effects in SiGe HBT current-mode logic circuits
Author
송익현
Keywords
current-mode logic (CML); heterojunction bipolar transistor (HBT); negative feedback; radiation hardening by design (RHBD); single-event effects (SEE); single-event transients (SET); silicon germanium (SiGe)
Issue Date
2020-05
Publisher
MDPI
Citation
SENSORS, v. 20, no. 9, article no. 2581
Abstract
It has been known that negative feedback loops (internal and external) in a SiGe heterojunction bipolar transistors (HBT) DC current mirrors improve single-event transient (SET) response; both the peak transient current and the settling time significantly decrease. In the present work, we demonstrate how radiation hardening by design (RHBD) techniques utilized in DC bias blocks only (current mirrors) can also improve the SET response in AC signal paths of switching circuits (e.g., current-mode logic, CML) without any additional hardening in those AC signal paths. Four CML circuits both with and without RHBD current mirrors were fabricated in 130 nm SiGe HBT technology. Two existing RHBD techniques were employed separately in the current mirrors of the CML circuits: (1) applying internal negative feedback and (2) adding a large capacitor in a sensitive node. In addition, these methods are also combined to analyze the overall SET performance. The single-event transients of the fabricated circuits were captured under the two-photon-absorption laser-induced single-event environment. The measurement data clearly show significant improvements in SET response in the AC signal paths of the CML circuits by using the two radiation hardening techniques applied only in DC current mirrors. The peak output transient current is notably reduced, and the settling time upon a laser strike is shortened significantly.
URI
https://www.mdpi.com/1424-8220/20/9/2581https://repository.hanyang.ac.kr/handle/20.500.11754/167122
ISSN
1424-8220
DOI
10.3390/s20092581
Appears in Collections:
COLLEGE OF ENGINEERING[S](공과대학) > ELECTRONIC ENGINEERING(융합전자공학부) > Articles
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