128 59

Interfacial Chemical and Mechanical Reactions between Tungsten-Film and Nano-Scale Colloidal Zirconia Abrasives for Chemical-Mechanical-Planarization

Title
Interfacial Chemical and Mechanical Reactions between Tungsten-Film and Nano-Scale Colloidal Zirconia Abrasives for Chemical-Mechanical-Planarization
Author
박재근
Keywords
catalyst; Colloidal zirconia; tungsten; Chemical mechanical planarization
Issue Date
2020-05
Publisher
ELECTROCHEMICAL SOC INC
Citation
ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, v. 9, no. 5, article no. 054001
Abstract
In tungsten (W) film chemical-mechanical-planarization (CMP), the chemical and mechanical reaction behaviors of the W film surface play a critical role in the CMP performance, as determined by oxidation (i.e.,WO3), corrosion (i.e., WO42-), and the electrostatic force at the interface between abrasives and the surface. Unlike a conventional catalyst (i.e., Fe(NO3)(3)) for a Fenton reaction in a CMP slurry, a new catalyst ((i.e., potassium ferric oxalate: K3Fe(C2O4)(3))) and a new nano-scale (i.e., 23 nm in diameter) abrasives (i.e., Zirconia:ZrO2) provides specific CMP performance behavior: the maximum W-film polishing rate and a corrosion-free surface are achieved at a specific catalyst concentration (0.03 wt%), and the number of remaining abrasives adsorbed on the W film surface after CMP decreases with increasing concentration of the K3Fe(C2O4)(3). These CMP performance characteristics are associated with the following results: (i) The degrees of two different CMP mechanisms (oxidation-dominant or corrosion-dominant) determine the corrosion-free surface of W film. (ii) The dependency of the electrostatic force at the interface between abrasives and the film on the K3Fe(C2O4)(3) concentration determines the polishing rate. Finally, (iii) the zeta potential distribution at the interface between the abrasives and the film directly affects the number of remaining abrasives on the surface after CMP.
URI
https://iopscience.iop.org/article/10.1149/2162-8777/ab915chttps://repository.hanyang.ac.kr/handle/20.500.11754/166315
ISSN
2162-8769; 2162-8777
DOI
10.1149/2162-8777/ab915c
Appears in Collections:
COLLEGE OF ENGINEERING[S](공과대학) > ELECTRONIC ENGINEERING(융합전자공학부) > Articles
Files in This Item:
Interfacial Chemical and Mechanical Reactions between Tungsten-Film and Nano-Scale Colloidal Zirconia Abrasives for Chemical-Mechanical-Planarizati...Download
Export
RIS (EndNote)
XLS (Excel)
XML


qrcode

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.

BROWSE