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dc.contributor.author유봉영-
dc.date.accessioned2021-07-28T06:48:01Z-
dc.date.available2021-07-28T06:48:01Z-
dc.date.issued2020-06-
dc.identifier.citationJOURNAL OF ALLOYS AND COMPOUNDS, v. 846, Article no. 156488, 6ppen_US
dc.identifier.issn0925-8388-
dc.identifier.urihttps://www.sciencedirect.com/science/article/pii/S0925838820328528-
dc.identifier.urihttps://repository.hanyang.ac.kr/handle/20.500.11754/163398-
dc.description.abstractElectrodeposited Cu film shows grain growth at room temperature, referred to as self-annealing. The present work reports changes in microstructures and properties of electroplated Cu film during self-annealing. The as-deposited Cu film shows an ultrahigh strength of 876 MPa due to a high density of defects such as grain boundaries and dislocations. The tensile strength and resistivity of the electroplated copper film decrease as the time after deposition increases. The combined effect of reduction in grain boundary energy and elastic energy of dislocations could lead to the observed self-annealing in the investigated Cu film. Further, the investigated electroplated Cu film shows considerably low stacking fault energy of approximately 6 mJ/m(2), which leads to the frequent formation of twins in the self-annealed grains. (C) 2020 Elsevier B.V. All rights reserved.en_US
dc.language.isoen_USen_US
dc.publisherELSEVIER SCIENCE SAen_US
dc.subjectNANOCRYSTALLINE COPPERen_US
dc.subjectGRAIN-GROWTHen_US
dc.subjectTENSILEen_US
dc.subjectSTRESSen_US
dc.subjectFILMSen_US
dc.subjectENERGIESen_US
dc.subjectKINETICSen_US
dc.titleEvolution of microstructures and mechanical properties of ultrahigh strength, pure electrodeposited Cu during self-annealingen_US
dc.typeArticleen_US
dc.relation.volume846-
dc.identifier.doi10.1016/j.jallcom.2020.156488-
dc.relation.page1-6-
dc.relation.journalJOURNAL OF ALLOYS AND COMPOUNDS-
dc.contributor.googleauthorLee, Chaerin-
dc.contributor.googleauthorKim, Youjung-
dc.contributor.googleauthorKim, Rosa-
dc.contributor.googleauthorKim, Jin-Kyung-
dc.contributor.googleauthorYoo, Bongyoung-
dc.relation.code2020047954-
dc.sector.campusE-
dc.sector.daehakCOLLEGE OF ENGINEERING SCIENCES[E]-
dc.sector.departmentDEPARTMENT OF MATERIALS SCIENCE AND CHEMICAL ENGINEERING-
dc.identifier.pidbyyoo-
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COLLEGE OF ENGINEERING SCIENCES[E](공학대학) > MATERIALS SCIENCE AND CHEMICAL ENGINEERING(재료화학공학과) > Articles
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