165 0

Evolution of microstructures and mechanical properties of ultrahigh strength, pure electrodeposited Cu during self-annealing

Title
Evolution of microstructures and mechanical properties of ultrahigh strength, pure electrodeposited Cu during self-annealing
Author
유봉영
Keywords
NANOCRYSTALLINE COPPER; GRAIN-GROWTH; TENSILE; STRESS; FILMS; ENERGIES; KINETICS
Issue Date
2020-06
Publisher
ELSEVIER SCIENCE SA
Citation
JOURNAL OF ALLOYS AND COMPOUNDS, v. 846, Article no. 156488, 6pp
Abstract
Electrodeposited Cu film shows grain growth at room temperature, referred to as self-annealing. The present work reports changes in microstructures and properties of electroplated Cu film during self-annealing. The as-deposited Cu film shows an ultrahigh strength of 876 MPa due to a high density of defects such as grain boundaries and dislocations. The tensile strength and resistivity of the electroplated copper film decrease as the time after deposition increases. The combined effect of reduction in grain boundary energy and elastic energy of dislocations could lead to the observed self-annealing in the investigated Cu film. Further, the investigated electroplated Cu film shows considerably low stacking fault energy of approximately 6 mJ/m(2), which leads to the frequent formation of twins in the self-annealed grains. (C) 2020 Elsevier B.V. All rights reserved.
URI
https://www.sciencedirect.com/science/article/pii/S0925838820328528https://repository.hanyang.ac.kr/handle/20.500.11754/163398
ISSN
0925-8388
DOI
10.1016/j.jallcom.2020.156488
Appears in Collections:
COLLEGE OF ENGINEERING SCIENCES[E](공학대학) > MATERIALS SCIENCE AND CHEMICAL ENGINEERING(재료화학공학과) > Articles
Files in This Item:
There are no files associated with this item.
Export
RIS (EndNote)
XLS (Excel)
XML


qrcode

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.

BROWSE