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Improvement of Productivity through the Reduction of Unexpected Equipment Faults in Die Attach Equipment

Title
Improvement of Productivity through the Reduction of Unexpected Equipment Faults in Die Attach Equipment
Author
허선
Keywords
die attach process; wafer sawing process; back grinding process; unexpected equipment fault; loss; overall equipment effectiveness (OEE); unit per equipment hour (UPEH); productivity analysis system
Issue Date
2020-03
Publisher
MDPI AG
Citation
PROCESSES, v. 8, no. 4, page. 1-18
Abstract
As one of the semiconductor back-end processes, die attach process is the process that attaches an individual non-defective die (or chip) produced from the semiconductor front-end production to the lead frame on a strip. With most other processes of semiconductor manufacturing, it is very important to improve productivity by lessening the occurrence of defective products generally represented as losses, and then find the fault causes which lower productivity of the die attach process. Thus, as the case study to analyze quantitatively the faults of the die attach process equipment, in this research, we developed analysis systems including statistical analysis functions to improve the productivity of die attach process. This research shows that the developed system can find the causes of equipment faults in die attach process equipment and help improve the productivity of the die attach process by controlling the critical parameters which cause unexpected equipment faults and losses.
URI
https://www.proquest.com/docview/2384671857?accountid=11283https://repository.hanyang.ac.kr/handle/20.500.11754/163043
ISSN
2227-9717
DOI
10.3390/PR8040394
Appears in Collections:
COLLEGE OF ENGINEERING SCIENCES[E](공학대학) > INDUSTRIAL AND MANAGEMENT ENGINEERING(산업경영공학과) > Articles
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