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Physical and Chemical Characterization of Recycled Oxide CMP Slurry

Title
Physical and Chemical Characterization of Recycled Oxide CMP Slurry
Other Titles
재생된 옥사이드 CMP 슬러리의 물리적, 화학적 특징에 대한 연구
Author
박진구
Issue Date
2001-11
Publisher
한국마이크로전자및패키징학회
Citation
한국마이크로전자및패키징학회 학술대회논문집 2001, page. 235-239
Abstract
In recent years, as Chemical Mechanical Planarization(CMP) has been routinely utilized in integrated circuit(IC) fabrication, the consumption of slurry, main consumable in a CMP process, is greatly increased. Thus the reprocess of CMP slurries has been actively considered in the industry to reduce cost-of-consumable (COC). The main purpose of this study was to recycle the used oxide slurry using filters as a new method. As a result, Ultra Fine(UF) Filter could distinguish silica from the used oxide slurry and Reverse Osmosis(RO) Filter could distinguish Deionized(DI) Water and chemistry from chemistry solution. The tetraethylorthosilicate removal rate was almost the same as the number of recycle polishing was increased, when it was modified by slightly adding new SS-12 slurry. The microscratch didnt found as the number of recycle polishing was increased.
URI
koreascience.kr/article/CFKO200111921015014.pagehttps://repository.hanyang.ac.kr/handle/20.500.11754/161426
Appears in Collections:
COLLEGE OF ENGINEERING SCIENCES[E](공학대학) > MATERIALS SCIENCE AND CHEMICAL ENGINEERING(재료화학공학과) > Articles
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