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dc.contributor.author박진구-
dc.date.accessioned2021-04-15T05:10:54Z-
dc.date.available2021-04-15T05:10:54Z-
dc.date.issued2001-11-
dc.identifier.citation한국마이크로전자및패키징학회 학술대회논문집 2001, page. 235-239en_US
dc.identifier.urikoreascience.kr/article/CFKO200111921015014.page-
dc.identifier.urihttps://repository.hanyang.ac.kr/handle/20.500.11754/161426-
dc.description.abstractIn recent years, as Chemical Mechanical Planarization(CMP) has been routinely utilized in integrated circuit(IC) fabrication, the consumption of slurry, main consumable in a CMP process, is greatly increased. Thus the reprocess of CMP slurries has been actively considered in the industry to reduce cost-of-consumable (COC). The main purpose of this study was to recycle the used oxide slurry using filters as a new method. As a result, Ultra Fine(UF) Filter could distinguish silica from the used oxide slurry and Reverse Osmosis(RO) Filter could distinguish Deionized(DI) Water and chemistry from chemistry solution. The tetraethylorthosilicate removal rate was almost the same as the number of recycle polishing was increased, when it was modified by slightly adding new SS-12 slurry. The microscratch didnt found as the number of recycle polishing was increased.en_US
dc.language.isoenen_US
dc.publisher한국마이크로전자및패키징학회en_US
dc.titlePhysical and Chemical Characterization of Recycled Oxide CMP Slurryen_US
dc.title.alternative재생된 옥사이드 CMP 슬러리의 물리적, 화학적 특징에 대한 연구en_US
dc.typeArticleen_US
dc.relation.journal마이크로전자 및 패키징학회지-
dc.contributor.googleauthor김명식-
dc.contributor.googleauthor이관호-
dc.contributor.googleauthor박진구-
dc.relation.code2012100509-
dc.sector.campusE-
dc.sector.daehakCOLLEGE OF ENGINEERING SCIENCES[E]-
dc.sector.departmentDEPARTMENT OF MATERIALS SCIENCE AND CHEMICAL ENGINEERING-
dc.identifier.pidjgpark-
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COLLEGE OF ENGINEERING SCIENCES[E](공학대학) > MATERIALS SCIENCE AND CHEMICAL ENGINEERING(재료화학공학과) > Articles
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