Kinetics of Au-containing Ternary Intermetallic Redeposition at Solder/UBM Interface
- Title
- Kinetics of Au-containing Ternary Intermetallic Redeposition at Solder/UBM Interface
- Author
- 신동혁
- Keywords
- Au-embrittlement; aging treatment; Au-containing ternary intermetallic; redeposition; fracture energy
- Issue Date
- 2001-09
- Publisher
- The Minerals, Metals & Materials Society
- Citation
- Journal of Electronic Materials, v. 30, no. 9, page. 1138-1144
- Abstract
- In this study, the effects of the under bump metallurgy (UBM) structure and Cu content in solders on the redeposition rate of Au-containing ternary intermetallics at the solder/UBM interface were investigated. A UBM structure with a Ni diffusion barrier, Au/Ni/Cu, appeared to promote the redeposition of ternary Au-containing intermetallics at the solder/UBM interface of the ternary during the solid-state aging treatment and the Au-embrittlement of the solder interconnections. Copper added to the eutectic Sn-Pb and Sn-Ag solders was observed to be very effective in retarding the redeposition by forming the ternary intermetallics in solder matrices and preventing the Au-embrittlement. These phenomena were discussed with the microstructures observed.
- URI
- https://link.springer.com/article/10.1007/s11664-001-0141-9https://repository.hanyang.ac.kr/handle/20.500.11754/160175
- ISSN
- 0361-5235; 1543-186X
- DOI
- 10.1007/s11664-001-0141-9
- Appears in Collections:
- COLLEGE OF ENGINEERING SCIENCES[E](공학대학) > MATERIALS SCIENCE AND CHEMICAL ENGINEERING(재료화학공학과) > Articles
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