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PCM module을 이용한 이동통신장비의 냉각에 관한 연구

Title
PCM module을 이용한 이동통신장비의 냉각에 관한 연구
Other Titles
A Study of Cooling of Mobile Telecommunication Equipment Using PCM Module
Author
김우승
Keywords
Phase Change Material(상변화물질); Latent Heat(잠열); Enthalpy Method(엔탈피법)
Issue Date
2002-11
Publisher
대한설비공학회
Citation
대한설비공학회 2002년도 동계학술발표회 논문집, page. 29-34
Abstract
The cooling effect of a mobile phone using PCM module has been numerically investigated. A transient 3-D numerical analysis of heat and fluid flow with natural convection is performed in this study. Governing conservation equations for mass, momentum and energy are solved by an implicit finite volume method. An enthalpy-porosity technique is applied for modeling of the melting process. Two different ways of placing the PCM module are considered. One is to place a PCM module between the substrate and battery pack, and the other is to place a PCM module between MCM(muItichip module) and battery pack. Three different types of PCMs are used to predict the performance of PCM. The results show that passive cooling with PCM can reduce the temperature rise and the effect of natural convection in PCM module which is flat and thin can be ignored.
URI
http://www.dbpia.co.kr/journal/articleDetail?nodeId=NODE00694348?https://repository.hanyang.ac.kr/handle/20.500.11754/157960
Appears in Collections:
COLLEGE OF ENGINEERING SCIENCES[E](공학대학) > MECHANICAL ENGINEERING(기계공학과) > Articles
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