PCM module을 이용한 이동통신장비의 냉각에 관한 연구

Abstract

The cooling effect of a mobile phone using PCM module has been numerically investigated. A transient 3-D numerical analysis of heat and fluid flow with natural convection is performed in this study. Governing conservation equations for mass, momentum and energy are solved by an implicit finite volume method. An enthalpy-porosity technique is applied for modeling of the melting process. Two different ways of placing the PCM module are considered. One is to place a PCM module between the substrate and battery pack, and the other is to place a PCM module between MCM(muItichip module) and battery pack. Three different types of PCMs are used to predict the performance of PCM. The results show that passive cooling with PCM can reduce the temperature rise and the effect of natural convection in PCM module which is flat and thin can be ignored.