169 0

The mechanical property of electroplated Cu film

Title
The mechanical property of electroplated Cu film
Author
안유민
Keywords
Electroplating; Copper film; Residual stress; Elastic Modulus; Hardness
Issue Date
2002-10
Publisher
한국트라이볼로지학회
Citation
한국윤활학회 2002년도 Proceedings of The Second Asia International Conference on Tribology, page. 139-140
Abstract
This paper discusses the effect of plating condition on the mechanical property of electroplated Cu film. Current density, the amount of the organic additives was found to affect the residual stress of electroplated copper film. The result show that, in the case of residual stress, the copper film deposited at higher additive result in lower residual stress and a plating current by 15㎃/㎠ induced a better result than any other ones.
URI
http://www.dbpia.co.kr/journal/articleDetail?nodeId=NODE01503196https://repository.hanyang.ac.kr/handle/20.500.11754/157677
Appears in Collections:
COLLEGE OF ENGINEERING SCIENCES[E](공학대학) > MECHANICAL ENGINEERING(기계공학과) > Articles
Files in This Item:
There are no files associated with this item.
Export
RIS (EndNote)
XLS (Excel)
XML


qrcode

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.

BROWSE