한국윤활학회 2002년도 Proceedings of The Second Asia International Conference on Tribology, page. 139-140
Abstract
This paper discusses the effect of plating condition on the mechanical property of electroplated Cu film. Current density, the amount of the organic additives was found to affect the residual stress of electroplated copper film. The result show that, in the case of residual stress, the copper film deposited at higher additive result in lower residual stress and a plating current by 15㎃/㎠ induced a better result than any other ones.