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dc.contributor.author박성주-
dc.date.accessioned2020-11-09T05:09:49Z-
dc.date.available2020-11-09T05:09:49Z-
dc.date.issued2003-03-
dc.identifier.citation전기학회논문지 D. v. 52, no. 3, page. 156-162en_US
dc.identifier.issn1229-6287-
dc.identifier.urihttp://www.dbpia.co.kr/journal/articleDetail?nodeId=NODE01261997-
dc.identifier.urihttps://repository.hanyang.ac.kr/handle/20.500.11754/155250-
dc.description.abstractFor a Systern—on-a—Ch ip(SoC ) comprised of mu ltip le IP cores, various design techniques have been proposed to provide diverse test link configurations. In this paper, we introduce a new instruction based W rapped Core L ink ing M odu le (W C LM ) tha t enables systematic integration of IE E E 1149.1 T A P 'd cores and P I 500 wrapped cores w ith requiring least amount o f area overhead compared w ith other state—o f—art techniques. The design preserves compatibility w ith standards and scalability for hierarchical accessen_US
dc.language.isoko_KRen_US
dc.publisher대한전기학회en_US
dc.subject경계스캔 설계en_US
dc.subjectIEEE 1149.1en_US
dc.subjectP1500en_US
dc.subjectSoC 테스트en_US
dc.subject코아 테스트en_US
dc.title계층적 SoC 테스트 접근을 위한 명령어 기반 코아 연결 모듈의 설계en_US
dc.title.alternativeA Design of Instruction Based Wrapped Core Linking Module for Hierarchical SoC Test Accessen_US
dc.typeArticleen_US
dc.relation.journal전기학회논문지(A,B,C,D)-
dc.contributor.googleauthor이현빈-
dc.contributor.googleauthor박성주-
dc.relation.code2012101073-
dc.sector.campusE-
dc.sector.daehakCOLLEGE OF COMPUTING[E]-
dc.sector.departmentDIVISION OF COMPUTER SCIENCE-
dc.identifier.pidpaksj-
Appears in Collections:
COLLEGE OF COMPUTING[E](소프트웨어융합대학) > COMPUTER SCIENCE(소프트웨어학부) > Articles
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