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In-situ thickness measurement of epoxy molding compound in semiconductor package products using a Terahertz-Time of Flight System

Title
In-situ thickness measurement of epoxy molding compound in semiconductor package products using a Terahertz-Time of Flight System
Author
김학성
Keywords
Measurement; Non-contact; Terahertz waves; Thickness
Issue Date
2019-07
Publisher
ELSEVIER SCI LTD
Citation
NDT & E INTERNATIONAL, v. 105, Page. 11-18
Abstract
Refractive index and thickness of an epoxy molding compound (EMC) were successfully measured without any advance knowledge of properties of material using the Terahertz-Time of Flight System (THz-TFS). The theoretical analysis for calculation of the refractive index and thickness of EMC was conducted considering two time-delay values of emission and detection mode (normal reflection mode and transmission mode). By combining two time-delay values from the normal reflection and transmission modes, the refractive index of EMC could be directly deduced without any parameter of the properties of specimen. The thickness of EMC mold could be simultaneously calculated by using only THz time-delay values. The thickness measurement results using THz-TFS were verified with the thickness measured through scanning electron microscopy (SEM).
URI
https://www.sciencedirect.com/science/article/pii/S0963869518304869?via%3Dihubhttps://repository.hanyang.ac.kr/handle/20.500.11754/152358
ISSN
0963-8695; 1879-1174
DOI
10.1016/j.ndteint.2019.04.012
Appears in Collections:
COLLEGE OF ENGINEERING[S](공과대학) > MECHANICAL ENGINEERING(기계공학부) > Articles
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