Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 김동국 | - |
dc.date.accessioned | 2020-04-13T03:32:28Z | - |
dc.date.available | 2020-04-13T03:32:28Z | - |
dc.date.issued | 2004-08 | - |
dc.identifier.citation | MACROMOLECULAR RESEARCH, v. 12, No. 4, Page. 391-398 | en_US |
dc.identifier.issn | 1598-5032 | - |
dc.identifier.uri | https://link.springer.com/article/10.1007/BF03218417 | - |
dc.identifier.uri | https://repository.hanyang.ac.kr/handle/20.500.11754/149413 | - |
dc.description.abstract | Thick-film photolithography is a new technology that combines lithography processes, such as exposure and development, with the conventional thick-film process applied to screen-printing. In this study, we developed a low-temperature cofireable silver paste applicable for thick-film processing to form fine lines using photolithographic technologies. The optimum paste composition for forming fine lines was investigated. The effect of processing parameters, such as the exposing dose, had on the fine-line resolution was also investigated. As the result, we found that the type of polymer and monomer, the silver powder loading, and the amount of photoinitiator were the main factors affecting the resolution of the fine lines. The developed photoimageable silver paste was printed on a low-temperature cofireable green sheet, dried, exposed, developed in an aqueous process, laminated, and then fired. Our results demonstrate that thick-film fine lines having widths < 20 μm can be obtained after cofiring. | en_US |
dc.description.sponsorship | This research was conducted through the financial support of National R & D Project of Ministry of Science and Technology of Korea. | en_US |
dc.language.iso | en_US | en_US |
dc.publisher | POLYMER SOC KOREA | en_US |
dc.subject | photoimageable | en_US |
dc.subject | silver paste | en_US |
dc.subject | low-temperature cofiring | en_US |
dc.subject | thick-film photolithography | en_US |
dc.subject | fine-line resolution | en_US |
dc.title | Fabrication of Photoimageable Silver Paste for Low-Temperature Confiring Using Acrylic Binder Polymers and Photosensitive Materials | en_US |
dc.type | Article | en_US |
dc.identifier.doi | 10.1007/BF03218417 | - |
dc.relation.journal | MACROMOLECULAR RESEARCH | - |
dc.contributor.googleauthor | Park, Seong-Dae | - |
dc.contributor.googleauthor | Yoo, Myong-Jae | - |
dc.contributor.googleauthor | Kang, Nam-Kee | - |
dc.contributor.googleauthor | Park, Jong-Chul | - |
dc.contributor.googleauthor | Lim, Jin-Kyu | - |
dc.contributor.googleauthor | Kim, Dong-Kook | - |
dc.relation.code | 2009210429 | - |
dc.sector.campus | E | - |
dc.sector.daehak | COLLEGE OF SCIENCE AND CONVERGENCE TECHNOLOGY[E] | - |
dc.sector.department | DEPARTMENT OF CHEMICAL AND MOLECULAR ENGINEERING | - |
dc.identifier.pid | dkkim | - |
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