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오염 방지를 위한 소수성 컨디셔너의 개발 및 평가

Title
오염 방지를 위한 소수성 컨디셔너의 개발 및 평가
Author
김동찬
Advisor(s)
박진구
Issue Date
2011-02
Publisher
한양대학교
Degree
Master
Abstract
Chemical mechanical planarization (CMP) is one of the processing steps in the manufacturing of integrated circuits which is used to planarize the wafer surface. Pad conditioning is one of the critical steps in the CMP process to maintain material removal rate (MRR) and its uniformity. If the surface of conditioner is contaminated by slurry residue during CMP process, not only the life of conditioner and MRR are reduced but also the scratches might generate due to the fallout of these particles from conditioner. Hence, to prevent the conditioner from contamination, formation of vapor self assembled monolayer (VSAM), on its surface was considered as it can prevent the contamination due to its hydrophobic nature. In this study, 3 types of precursors FOTS, 1 ?dodecanethiol and PFDA which have different bonding mechanisms were investigated for the formation of VSAM. As a first part of the study, processing variables such as temperature and pressure for V-SA M process were optimized. In the second part of the study, the performance of the coatings on Ni conditioner was evaluated by particle contamination and scratch detection test. Particle contamination test studies reveal that particle contaminations are reduced with FOTS and 1 ?dodecanethiol coating, whereas in the case of PFDA coating, the opposite trend is observed i.e. particle contamination is enhanced. Hence, only FOTS and 1 ?dodecanethiol coatings were considered for the further evaluation studies. From the scratch detection studies, it is observed that scratch generation on the wafer surface is reduced with both the coatings surface though the scratch reduction number is higher for 1-dodecanethiol coating. Electrochemical characterization was also carried out to estimate the film properties and protection efficiency of these coatings from corrosion attack on underlying Ni substrate. Both potentiodynamic polarization and electrochemical impedance studies were carried out and commercial Cu CMP slurry is used as an electrolyte solution. Impedance data is analyzed by electrical equivalent circuit model and the result shows that higher resistance and lower capacitance is obtained with both these coatings which mean that the monolayer is closely packed. The protection efficiency of both these coatings are higher i.e. above 95%.
URI
http://dcollection.hanyang.ac.kr/jsp/common/DcLoOrgPer.jsp?sItemId=000000059972https://repository.hanyang.ac.kr/handle/20.500.11754/139966
Appears in Collections:
GRADUATE SCHOOL[S](대학원) > BIONANOTECHNOLOGY(바이오나노학과) > Theses (Master)
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